AO4407 Rev.14.0 Rohs - Alpha & Omega Semiconductor

AO4407 -+ VDC Ig Vds DUT-+ VDC Vgs Vgs 10V Qg Qgs Qgd Charge Gate Charge Test Circuit & Waveform-+ VDC Vgs DUT Vdd Vds Vgs RL Rg Vgs Vds 10% 90% Resis...

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AO4407 30V P-Channel MOSFET

General Description

Product Summary

The AO4407 combines advanced trench MOSFET technology with a low resistance package to provide extremely low RDS(ON). This device is ideal for load switch and battery protection applications.

ID (at VGS=-20V)

-30V -12A

RDS(ON) (at VGS=-20V)

< 13mΩ

VDS

RDS(ON) (at VGS =-10V)

< 14mΩ

RDS(ON) (at VGS =-5V)

< 30mΩ

* RoHS and Halogen-Free Compliant 100% UIS Tested 100% Rg Tested

SOIC-8 Top View D D

D

Bottom View

D D

G

G S

S

S S

Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain Current

VGS TA=25°C

Units V

±25

V

-12

ID

TA=70°C

Maximum -30

-10

A

Pulsed Drain Current C

IDM

Avalanche Current C

IAS, IAR

26

A

Avalanche energy L=0.3mH C TA=25°C

EAS, EAR

101

mJ

Power Dissipation B

Junction and Storage Temperature Range

Rev.14.0: July 2013

3.1

PD

TA=70°C

Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Lead

-60

TJ, TSTG

Symbol t ≤ 10s Steady-State Steady-State

W

2

RθJA RθJL

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-55 to 150

Typ 31 59 16

°C

Max 40 75 24

Units °C/W °C/W °C/W

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AO4407

Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol

Parameter

STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage IDSS

Zero Gate Voltage Drain Current

Conditions

Min

ID=-250µA, VGS=0V

-30

Typ

-1 TJ=55°C

-5

Gate-Body leakage current

VDS=0V, VGS= ±25V

VGS(th)

Gate Threshold Voltage

VDS=VGS ID=-250µA

-1.7

ID(ON)

On state drain current

VGS=-10V, VDS=-5V

-60

±100

nA

-2.8

V

VGS=-20V, ID=-12A

8.5

13

mΩ

VGS=-10V, ID=-12A

10

14

12

19 30

A

Static Drain-Source On-Resistance

VGS=-5V, ID=-7A

19

gFS

Forward Transconductance

VDS=-5V, ID=-10.5A

27

VSD

Diode Forward Voltage

IS=-1A,VGS=0V

IS

Maximum Body-Diode Continuous Current

TJ=125°C

-0.72

DYNAMIC PARAMETERS Input Capacitance Ciss Output Capacitance Reverse Transfer Capacitance

Rg

Gate resistance

2060 VGS=0V, VDS=-15V, f=1MHz VGS=0V, VDS=0V, f=1MHz

Gate Source Charge

Qgd

Gate Drain Charge

tD(on)

Turn-On DelayTime

tr

Turn-On Rise Time

tD(off)

Turn-Off DelayTime

24 VGS=-10V, VDS=-15V, ID=-12A

VGS=-10V, VDS=-15V, RL=1.25Ω, RGEN=3Ω

mΩ S V

-4

A

2600

pF

370 1.2

mΩ

-1

pF

295

SWITCHING PARAMETERS Qg Total Gate Charge Qgs

µA

-2.25

RDS(ON)

Crss

Units V

VDS=-30V, VGS=0V

IGSS

Coss

Max

pF

2.4

3.6

30

36

Ω nC

4.6

nC

10

nC

11

ns

9.4

ns

24

ns

tf

Turn-Off Fall Time

trr

Body Diode Reverse Recovery Time

IF=-12A, dI/dt=100A/µs

30

Qrr

Body Diode Reverse Recovery Charge IF=-12A, dI/dt=100A/µs

22

12

ns 40

ns nC

A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep initialTJ=25°C. D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.

THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

Rev.14.0: July 2013

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AO4407

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 80

80 -10V

-6V

VDS=-5V

-5V 60

-ID(A)

-ID (A)

60

-4.5V

40

125°C

20

-4V

20

40

25°C

VGS=-3.5V 0

0 0

1

2

3

4

1

5

3

4

5

6

VGS(Volts) Figure 2: Transfer Characteristics (Note E)

-VDS (Volts) Fig 1: On-Region Characteristics (Note E) 30 Normalized On-Resistance

1.6

25 VGS=-5V RDS(ON) (mΩ Ω)

2

20 15 10 VGS=-10V 5 0

VGS=-10V ID=-12A

1.4

17 5 2 10

1.2

1

VGS=-5V ID=-7A

0.8 0

0

5

10 15 20 -ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E)

25

50

75

100

125

150

175

0 Temperature (°C) Figure 4: On-Resistance vs. Junction 18Temperature (Note E)

30

1.0E+01 ID=-12A 1.0E+00

25

40

20

125°C

IS (A)

RDS(ON) (mΩ Ω)

1.0E-01 125°C

1.0E-02

15 25°C

1.0E-03 25°C

10

1.0E-04 1.0E-05

5 2

6 8 10 -VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E)

Rev.14.0: July 2013

4

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0.0

0.2

0.4

0.6

0.8

1.0

1.2

-VSD (Volts) Figure 6: Body-Diode Characteristics (Note E)

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AO4407

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 3000

10 VDS=-15V ID=-12A

2500 Ciss Capacitance (pF)

-VGS (Volts)

8

6

4

2

2000 1500 1000 Coss 500

0

Crss

0 0

5 10 15 20 25 Qg (nC) Figure 7: Gate-Charge Characteristics

30

0

1000.0

5 10 15 20 25 -VDS (Volts) Figure 8: Capacitance Characteristics

30

10000 TA=25°C

10.0

1000

10µs 100µs

RDS(ON) limited

Power (W)

ID (Amps)

100.0

1ms 1.0

10ms

10

TJ(Max)=150°C TA=25°C

0.1

100

10s DC 1

0.0 0.01

0.1

1 VDS (Volts)

10

0.00001

100

0.001

0.1

10

1000

Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note F)

Figure 9: Maximum Forward Biased Safe Operating Area (Note F)

Zθ JA Normalized Transient Thermal Resistance

10 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1

In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

RθJA=75°C/W

0.1

PD

0.01 Single Pulse

Ton

T

0.001 0.00001

0.0001

0.001

0.01

0.1

1

10

100

1000

Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)

Rev.14.0: July 2013

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AO4407

Gate Charge Test Circuit & Waveform Vgs Qg 10V

+ + Vds

VDC

-

Qgs

Qgd

VDC

-

DUT Vgs Ig

Charge

Resistive Switching Test Circuit & Waveforms RL Vds Vds 90%

+ Vdd

DUT

Vgs

VDC

-

Rg

10%

Vgs

Vgs

t d(on)

tr

t d(off)

t on

tf toff

Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L

2

E AR = 1/2 LIAR

Vds

BVDSS

Vds

Id

+ Vdd

Vgs

Vgs

I AR

VDC

-

Rg

Id

DUT Vgs

Vgs

Diode Recovery Test Circuit & Waveforms Q rr = - Idt

Vds + DUT

Vds Isd Vgs Ig

Rev.14.0: July 2013

Vgs

L

Isd

+ Vdd

t rr

dI/dt I RM Vdd

VDC

-

IF

Vds

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