20 MHz to 6 GHz RF/IF Gain Block ADL5542
Data Sheet
FUNCTIONAL BLOCK DIAGRAM
Fixed gain of 20 dB Operation up to 6 GHz Input/output internally matched to 50 Ω Integrated bias control circuit Output IP3 46 dBm at 500 MHz 40 dBm at 900 MHz Output 1 dB compression: 20.6 dB at 900 MHz Noise figure of 3 dB at 900 MHz Single 5 V power supply Small footprint 8-lead LFCSP Pin compatible with 15 dB gain ADL5541 1 kV ESD (Class 1C)
RFIN 1
INPUT MATCH
OUTPUT MATCH
8
RFOUT
GND 2
BIAS CONTROL
7
GND
GND 3
ADL5542
6
GND
5
VPOS
CB 4
06879-001
FEATURES
Figure 1.
GENERAL DESCRIPTION The ADL5542 is a broadband 20 dB linear amplifier that operates at frequencies up to 6 GHz. The device can be used in a wide variety of CATV, cellular, and instrumentation equipment. The ADL5542 provides a gain of 20 dB that is stable over frequency, temperature, power supply, and from device to device. The device is internally matched to 50 Ω with an input return loss of 10 dB or better, up to 6 GHz. Only input/output ac coupling capacitors, power supply decoupling capacitors, and an external inductor are required for operation.
Rev. C
The ADL5542 is fabricated on an InGaP HBT process and has an ESD rating of 1 kV (Class 1C). The device is packaged in a 3 mm × 3 mm LFCSP that uses an exposed paddle for excellent thermal impedance. The ADL5542 consumes 93 mA on a single 5 V supply and is fully specified for operation from −40°C to +85°C. A fully populated RoHS-compliant evaluation board is available. The ADL5541 is a companion part that offers a gain of 15 dB in a pin-compatible package.
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ADL5542* PRODUCT PAGE QUICK LINKS Last Content Update: 11/29/2017
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Product Selection Guide • RF Source Booklet
EVALUATION KITS • ADL5542 Evaluation Board
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DOCUMENTATION
DESIGN RESOURCES
Application Notes
• ADL5542 Material Declaration
• AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers
• PCN-PDN Information
• AN-1389: Recommended Rework Procedure for the Lead Frame Chip Scale Package (LFCSP) • AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP) • Broadband Biasing of Amplifiers General Application Note • MMIC Amplifier Biasing Procedure Application Note • Thermal Management for Surface Mount Components General Application Note Data Sheet • ADL5542: 20 MHz to 6 GHz RF/IF Gain Block Data Sheet
TOOLS AND SIMULATIONS • ADI RF Amplifier Library for Agilent ADS • ADIsimPLL™
• Quality And Reliability • Symbols and Footprints
DISCUSSIONS View all ADL5542 EngineerZone Discussions.
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ADL5542
Data Sheet
TABLE OF CONTENTS Features .............................................................................................. 1
Typical Performance Characteristics ..............................................8
Functional Block Diagram .............................................................. 1
Operating to 20 MHz ................................................................. 10
General Description ......................................................................... 1
Basic Connections .......................................................................... 11
Revision History ............................................................................... 2 Specifications..................................................................................... 3
Soldering Information and Recommended PCB Land Pattern .......................................................................................... 11
Typical Scattering Parameters..................................................... 5
Evaluation Board ............................................................................ 12
Absolute Maximum Ratings ............................................................ 6
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 6
Ordering Guide .......................................................................... 13
Pin Configuration and Function Descriptions ............................. 7
REVISION HISTORY 2/15—Rev. B to Rev. C Changed Frequency Range from 50 MHz to 6000 MHz to 20 MHz to 6000 MHz (Throughout) ............................................. 1 Changes to Table 1 ............................................................................ 3 Added Figure 14 to Figure 19; Renumbered Sequentially ........ 10 Changes to Basic Connections Section and Table 5; Added Figure 21 and Figure 22 ................................................................. 11 Updated Outline Dimensions ....................................................... 13 Changes to Ordering Guide .......................................................... 13 12/13—Rev. A to Rev. B Added Figure 13; Renumbered Sequentially ................................ 9 10/07—Rev. 0 to Rev. A Changes to Figure 4 .......................................................................... 8 Change to Basic Connections Section ......................................... 10 Changes to Table 5 .......................................................................... 10 Change to Table 6 ........................................................................... 11 Deleted Notes from Ordering Guide Section ............................. 12 7/07—Revision 0: Initial Version
Rev. C | Page 2 of 13
Data Sheet
ADL5542
SPECIFICATIONS VPOS = 5 V and TA = 25°C, unless otherwise noted. Table 1. Parameter OVERALL FUNCTION Frequency Range Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Reverse Isolation (S12) FREQUENCY = 20 MHz Gain Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 100 MHz Gain Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 500 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 900 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 2000 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 2400 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure
Test Conditions/Comments
Min
Typ
Max
Unit
6000 19.7 −15 −10 −22
MHz dB dB dB dB
20.9 17.5 38 2.9
dB dBm dBm dB
20.2 19.6 37 3.0
dB dBm dBm dB
20 900 MHz Frequency 500 MHz to 5 GHz Frequency 500 MHz to 5 GHz
Δf = 1 MHz, output power (POUT) = 0 dBm per tone
Δf = 1 MHz, output power (POUT) = 0 dBm per tone
18.4 ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 3 dBm per tone
19.2 ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone
18 ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone
17.7 ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone
Rev. C | Page 3 of 13
19.5 ±0.15 ±0.1 ±0.02 20.6 46 2.8 19.7 ±0.03 ±0.14 ±0.02 20.6 40 3.0 18.7 ±0.05 ±0.23 ±0.04 18 39 3.2 18.3 ±0.05 ±0.24 ±0.04 16.8 38 3.5
20.8
3.2 20.8
3.3 19.4
3.6 18.9
3.8
dB dB dB dB dBm dBm dB dB dB dB dB dBm dBm dB dB dB dB dB dBm dBm dB dB dB dB dB dBm dBm dB
ADL5542 Parameter FREQUENCY = 3500 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure FREQUENCY = 5800 MHz Gain vs. Frequency vs. Temperature vs. Supply Output 1 dB Compression Point Output Third-Order Intercept Noise Figure POWER INTERFACE Supply Voltage (VPOS) Supply Current vs. Temperature Power Dissipation
Data Sheet Test Conditions/Comments
Min
Typ
Max
Unit
15.9
17.5 ±0.04 ±0.31 ±0.04 13.7 33 3.7
18.8
dB dB dB dB dBm dBm dB
±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone
11.2 ±50 MHz −40°C ≤ TA ≤ +85°C 4.75 V to 5.25 V Δf = 1 MHz, output power (POUT) = 0 dBm per tone
12.7 ±0.03 ±1.2 ±0.04 6.8 24.2 5.7
4.3 14.4
6.3
dB dB dB dB dBm dBm dB
Pin VPOS 4.5 −40°C ≤ TA ≤ +85°C VPOS = 5 V
Rev. C | Page 4 of 13
5 93 ±15 0.5
5.5 115
V mA mA W
Data Sheet
ADL5542
TYPICAL SCATTERING PARAMETERS VPOS = 5 V and TA = 25°C, the effects of the test fixture have been de-embedded up to the pins of the device. Table 2. Freq. (MHz) 50 100 500 900 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
Magnitude (dB) −23.9427 −29.6174 −34.5211 −37.74 −33.8877 −24.7749 −17.038 −9.60208 −8.00289 −7.91011 −12.816 −17.625 −12.8458 −10.9468 −5.69808
Angle (°) −127.394 −153.6 +19.99577 +147.4543 +131.3191 −152.311 +178.4399 +153.1961 +128.6464 +103.6543 +96.79933 +156.5961 +173.0378 −154.419 −150.164
Magnitude (dB) 20.77572 20.51771 20.23355 20.07428 20.07369 19.80607 19.5708 19.26227 18.82098 18.18117 17.38515 17.57137 16.39804 15.13047 13.48849
Angle (°) +170.5022 +170.3216 +152.6774 +132.0556 +127.0206 +101.2591 +76.03876 +49.85321 +24.3132 −1.63173 −26.2863 −52.0317 −77.6904 −102.402 −125.082
Rev. C | Page 5 of 13
Magnitude (dB) −23.0076 −22.6572 −22.5262 −22.4939 −22.4386 −22.3087 −21.9922 −21.6433 −21.0921 −21.2002 −20.7711 −20.0291 −19.9498 −19.8825 −20.3196
Angle (°) +3.044077 +1.38839 −10.9886 −21.2573 −23.7005 −35.6482 −48.9813 −60.9072 −76.3162 −91.6973 −103.208 −120.789 −136.697 −153.753 −170.25
Magnitude (dB) −23.9476 −32.4194 −26.2358 −20.2616 −20.323 −16.2712 −12.759 −9.74244 −8.77595 −10.5739 −13.1628 −7.31571 −6.22666 −9.89228 −10.7825
Angle (°) −132.996 −124.454 −129.115 −159.271 −160.866 +168.1644 +164.7149 +150.6577 +128.7323 +90.37487 +8.899607 −73.4032 −106.102 −111.644 −57.0274
ADL5542
Data Sheet
ABSOLUTE MAXIMUM RATINGS ESD CAUTION
Table 3. Parameter Supply Voltage, VPOS Input Power (re: 50 Ω) Internal Power Dissipation (Paddle Soldered) θJC (Junction to Paddle) Maximum Junction Temperature Operating Temperature Range Storage Temperature Range
Rating 6.5 V 10 dBm 650 mW 28.5°C/W 150°C −40°C to +85°C −65°C to +150°C
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
Rev. C | Page 6 of 13
Data Sheet
ADL5542
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS RFIN 1
ADL5542
7 GND
GND 3
TOP VIEW (Not to Scale)
6 GND
CB 4
5 VPOS
06879-002
8 RFOUT
GND 2
NOTES 1. EXPOSED PADDLE. INTERNALLY CONNECTED TO GND. SOLDER TO A LOW IMPEDANCE GROUND PLANE.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions Pin No. 1 2, 3, 6, 7 4 5 8 Exposed Paddle
Mnemonic RFIN GND CB VPOS RFOUT
Description RF Input. Requires a dc blocking capacitor. Ground. Connect these pins to a low impedance ground plane. Low Frequency Bypass. A 1 µF capacitor should be connected between this pin and ground. Power Supply for Bias Controller. Connect directly to external power supply. RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is tied to the external power supply. RF path requires a dc blocking capacitor. Exposed Paddle. Internally connected to GND. Solder to a low impedance ground plane.
Rev. C | Page 7 of 13
ADL5542
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS VPOS = 5 V and TA = 25°C, unless otherwise noted. C1 = 33 pF, C2 = 33 pF, L1 = 47 nH. 50
45
45 OIP3 (0dBm)
40
35
OIP3 AND P1dB (dBm)
GAIN, P1dB, OIP3, NF (dB, dBm)
40
30 25 20
GAIN
15 P1dB 10
OIP3 (+25°C)
35 OIP3 (–40°C) OIP3 (+85°C)
30 25 20
P1dB (+85°C)
15 10
0 0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
P1dB (–40°C)
5
0 0.5 0.9 1.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 5.7
5.5
FREQUENCY (GHz)
06879-006
06879-003
P1dB (+25°C) NF
5
FREQUENCY (GHz)
Figure 3. Gain, P1dB, OIP3, and Noise Figure vs. Frequency
Figure 6. OIP3 and P1dB vs. Frequency and Temperature 50
20 19
45 500MHz
18 –40°C
900MHz
40
17 OIP3 (dBm)
GAIN (dB)
+85°C 16 15 +25°C
14
35
2.4GHz 2GHz
30 3.5GHz
13
25
12 06879-007
10 0.5 0.9 1.3 1.7 2.1 2.5 2.9 3.3 3.7 4.1 4.5 4.9 5.3 5.7
20
06879-004
11
15 –3
0
3
6
9
12
18
15
POUT (dBm)
FREQUENCY (GHz)
Figure 4. Gain vs. Frequency and Temperature
Figure 7. OIP3 vs. Output Power (POUT) and Frequency
8
0 –5 S22
7
–15
NOISE FIGURE (dB)
S11, S22, S12 (dB)
–10
–20 S12
–25 –30 –35
6
5 +85°C +25°C
4
S11 –40
–50 0
1
2
3
4
5
–40°C 2 0
6
06879-008
06879-005
3
–45
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 8. Noise Figure vs. Frequency and Temperature
Figure 5. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency
Rev. C | Page 8 of 13
6.0
Data Sheet
ADL5542
50
40 35
40
PERCENTAGE (%)
PERCENTAGE (%)
30
30
20
25 20 15 10
10
0 38.0
39.2
40.4
06879-012
06879-009
5 0 2.40
41.6
2.52
2.64
2.76
OIP3 (dBm)
2.88
3.00
3.12
3.24
3.36
3.48
NOISE FIGURE (dB)
Figure 9. OIP3 Distribution at 900 MHz
Figure 12. Noise Figure Distribution at 900 MHz 110
25
5V, +85°C
105
SUPPLY CURRENT (mA)
PERCENTAGE (%)
20
15
10
100
5V, +25°C 95 90 85
5V, –40°C 5
0 20.3
20.4
20.5
20.6
20.7
20.8
20.9
75 –2
0
2
4
6
8
10
12
14
16
POUT (dBm)
P1dB (dBm)
Figure 13. Supply Current vs. POUT
Figure 10. P1dB Distribution at 900 MHz
40
20
10 06879-011
PERCENTAGE (%)
30
0 19.5
19.6
19.7
19.8
19.9
GAIN (dB)
Figure 11. Gain Distribution at 900 MHz
Rev. C | Page 9 of 13
18
20
22
06879-113
06879-010
80
ADL5542
Data Sheet
OPERATING TO 20 MHz VPOS = 5 V and TA = 25°C, unless otherwise noted. C1 = 0.1 µF, C2 = 0.1 µF, L1 = 1 µH. 45
45
OIP3 (+25°C)
OIP3
35 OIP3 AND P1dB (dBm)
35
30 25
GAIN 20
P1dB 15
OIP3 (–40°C)
30 25
P1dB (+85°C)
20 15
10
P1dB (–40°C)
P1dB (+25°C) 10
NF
0 20
40
60
80
100
120
140
FREQUENCY (MHz)
5 20
40
60
80
120
140
Figure 17. OIP3 and P1dB vs. Frequency and Temperature
Figure 14. Gain, P1dB, OIP3, and Noise Figure vs. Frequency 21.8
40
21.6
38 36
21.4
140MHz
100MHz 34
21.2
OIP3 (dBm)
+25°C 21.0
–40°C
20.8
+85°C
20.6
60MHz 20MHz
32 30 28
24
20.2
22
60
80
100
120
140
FREQUENCY (MHz)
20 –3
06879-115
40
Figure 15. Gain vs. Frequency and Temperature
0
3
6 9 POUT (dBm)
12
15
18
06879-118
26
20.4
20.0 20
Figure 18. OIP3 vs. Output Power (POUT) and Frequency
0
4.5
–5
4.0
–10 NOISE FIGURE (dB)
+85°C
–15
S11 –20
S12 –25
S22 –30
3.5
+25°C 3.0
–40°C
2.5 2.0
–35
–45 20
30
40
50
60
70
80
90
100 110 120 130 140
FREQUENCY (MHz)
Figure 16. Input Return Loss (S11), Output Return Loss (S22), and Reverse Isolation (S12) vs. Frequency
1.0
20
40
60
80
100
120
FREQUENCY (MHz)
Figure 19. Noise Figure vs. Frequency and Temperature
Rev. C | Page 10 of 13
140
06879-119
1.5
–40 06879-116
S11, S22, S22 (dB)
100
FREQUENCY (MHz)
06879-117
5
GAIN (dB)
OIP3 (+85°C)
40
06879-114
GAIN, P1dB, OIP3, NF (dB, dBm)
40
Data Sheet
ADL5542
BASIC CONNECTIONS 4.0
3.5
NOISE FIGURE (dB)
The basic connections for operating the ADL5542 are shown in Figure 20. Recommended components are listed in Table 5. The input and output should be ac-coupled with appropriately sized capacitors (device characterization was performed with 33 pF capacitors). A 5 V dc bias is supplied to the amplifier via VPOS (Pin 5) and through a biasing inductor connected to RFOUT (Pin 8). The bias voltage should be decoupled using a 1 µF capacitor, a 1.2 nF capacitor, and two 68 pF capacitors.
3.0
2.5
VCC C4 68pF
2.0 L1 47nH
ADL5542
C1 33pF
1 RFIN
C2 33pF
2 GND
GND 7
3 GND
GND 6
4 CB
1.5 200
RFOUT
RFOUT 8 GND
VPOS 5
C7 68pF
Figure 20. Basic Connections
For operation below 500 MHz, a larger biasing choke and ac coupling capacitors are necessary (see Table 5). Figure 21 shows Input return loss, output return loss, and gain for frequencies between 200 MHz and 500 MHz. The noise figure performance for operation from 200 MHz to 500 MHz is shown in Figure 22. 10
20.5
0 S21
GAIN (dB)
350
400
500
450
20.0
–10
19.5
–20 S11
–30
SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 23 shows the recommended land pattern for the ADL5542. To minimize thermal impedance, the exposed paddle on the package underside should be soldered down to a ground plane along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground layers exist, they should be stitched together using vias (a minimum of five vias is recommended). For more information on land pattern design and layout, refer to Application Note AN-772, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). 2.03mm
PIN 1
RETURN LOSS (dB)
21.0
19.0
300
Figure 22. Noise Figure vs. Frequency from 200 MHz to 500 MHz
VCC
C3 1µF
250
FREQUENCY (MHz)
06879-013
RFIN
C5 1.2nF
06879-122
C6 1µF
PIN 8
1.85mm
0.5mm
1.78mm
S22 PIN 4
–40
PIN 5 06879-016
18.5
250
300
350
400
450
–50 500
FREQUENCY (MHz)
06879-121
1.53mm
18.0 200
0.71mm
Figure 23. Recommended Land Pattern
Figure 21. Input Return Loss (S11), Output Return Loss (S22), and Gain (S21) vs. Frequency
Table 5. Recommended Components for Basic Connections Frequency 20 MHz to 200 MHz 200 MHz to 500 MHz 500 MHz to 6000 MHz
C1 0.1 µF 0.1 µF 33 pF
C2 0.1 µF 0.1 µF 33 pF
C3 1 µF 1 µF 1 µF
L1 1 µH (Coilcraft 0805LS-102XJL_ or equivalent) 470 nH (Coilcraft 0603LS-471NXJL_ or equivalent) 47 nH (Coilcraft 0603CS-47NXJL_ or equivalent)
Rev. C | Page 11 of 13
C4 68 pF 68 pF 68 pF
C5 1.2 nF 1.2 nF 1.2 nF
C6 1 µF 1 µF 1 µF
C7 68 pF 68 pF 68 pF
ADL5542
Data Sheet
EVALUATION BOARD W1
Figure 26 shows the schematic for the ADL5542 evaluation board. The board is powered by a single 5 V supply. VCC
C6 1µF
C5 1.2nF
C4 68pF L1 47nH
ADL5542
C1 33pF RFIN
06879-017
C3 1µF
1
RFIN
RFOUT 8
2
GND
GND 7
3
GND
4
CB
C2 33pF RFOUT GND
GND 6 VPOS 5 DUT1
C7 68pF
C8 OPEN
C9 OPEN VCC
06879-019
The components used on the board are listed in Table 6. Power can be applied to the board through clip-on leads (VCC and GND) or through a 2-pin header (W1).
Figure 26. Evaluation Board Schematic
06879-018
Figure 24. Evaluation Board Layout (Bottom)
Figure 25. Evaluation Board Layout (Top)
Table 6. Evaluation Board Configuration Options Component DUT1 C1, C2 C3 C4, C5, C6, C7, C8, C9
Function Gain block AC coupling capacitors Low frequency bypass capacitor Power supply decoupling capacitors
L1 VCC and GND W1
DC bias inductor Clip-on terminals for power supply 2-pin header for connection of ground and supply via cable
Rev. C | Page 12 of 13
Default Value ADL5542 33 pF, 0402 1 μF, 0805 C4, C7 = 68 pF, 0603 C5 = 1.2 nF, 0603 C6 = 1 μF, 0805 C8, C9 = open 47 nH, 0603 (Coilcraft 0603CS-47NXJL_ or equivalent)
Data Sheet
ADL5542
OUTLINE DIMENSIONS 1.84 1.74 1.64
3.10 3.00 SQ 2.90
0.50 BSC 8
5
PIN 1 INDEX AREA
1.55 1.45 1.35
EXPOSED PAD
0.80 0.75 0.70 SEATING PLANE
1
4 BOTTOM VIEW
TOP VIEW
0.05 MAX 0.02 NOM COPLANARITY 0.08 0.203 REF
0.30 0.25 0.20
PIN 1 INDICATOR (R 0.15)
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 12-07-2010-A
0.50 0.40 0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 27. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-8-13) Dimensions shown in millimeters
ORDERING GUIDE Model1 ADL5542ACPZ-R7 ADL5542-EVALZ 1
Temperature Range −40°C to +85°C
Package Description 8-Lead LFCSP_WD, 7” Tape and Reel Evaluation Board
Z = RoHS Compliant Part.
©2007–2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06879-0-2/15(C)
Rev. C | Page 13 of 13
Package Option CP-8-13
Branding Q15
