Materials Declaration Form
IPC Form Type * Sectionals *
1752
Version
Distribute
2
Subsectionals *
Material Info
A-D * : Required Field
Manufacturing Info Supplier Information Company Name *
STMicroelectronics
2013-03-19
Response Date *
Refer to " Supplier Comment" section Refer to " Supplier Comment" section
Contact Name * Contact Phone *
Refer to " Supplier Comment" section Refer to " Supplier Comment" section
Contact Title Contact Email *
Authorized Representative *
Emilio Castelli
Representative Title
Representative Phone *
Refer to " Supplier Comment" section
Representative Email *
Supplier Comment
Online Technical Support - STMicroelectronics : http://www.st.com/internet/com/support/online_tech_support.jsp
APG MD CHAMPION Refer to " Supplier Comment" section
Uncertainty Statement While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.
Legal Statement Supplier Acceptance *
Legal Statement
true
Legal Declaration *
Standard
Supplier certifies that it gathered the provided information and such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as omprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s), the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Supplier’s liability and the Company’s remedies for issues that arise regarding information the Supplier provides in this form.
Product Mfr Item Number
Mfr Item Name
Version
Mfr Site
Date
VN5T006ASPTR-E
A2IY*VH35BDX
A
MU1A
2013-03-19
Amount
UoM
Unit type
1140.00
mg
Each
J-STD-020 MSL Rating
Classification Temp
Nbr of Reflow Cycles
3
250
3
bulk Solder Termination
Terminal Plating
Terminal Base Alloy
Manufacturing information
Comment
Not Applicable ; if coating Tin is used (Sn),or bright, otherannealed bulk termaination Tin/Silver/Bismuth : add in comments (Sn/Ag/Bi) Copper Alloy
Package Designator
Size
Nbr of instances
Shape
CHP
9.4x7.5x3.5
10
pin
Comment
ST ECOPACK Grade ECOPACK® 1
Material Composition Declaration
A2IY*VH35BDX
Mfr Item Name
Homogeneous Material
Material Group
die (s)
Other inorganic materials
Mass
Substance Category
Substance
CAS
Exempt
Mass
UoM
1000001
supplier
die
Silicon (Si)
7440-21-3
19.443
mg
989869
17055
supplier
metallization
Aluminium (Al)
7429-90-5
0.018
mg
916
16
die (s)
supplier
passivation
Silicon Nitride (SiN)
68034-42-4
0.016
mg
815
14
die (s)
supplier
passivation
Silicon Oxide(SiO2)
7631-86-9
0.017
mg
865
15
die (s)
supplier
back side metallization
Titanium (Ti)
7440-32-6
0.008
mg
407
7
die (s)
supplier
back side metallization
Gold (Au)
7440-57-5
0.025
mg
1273
22
die (s)
supplier
back side metallization
Nickel (Ni)
7440-02-0
0.115
mg
5855
101
supplier
alloy
Copper (Cu)
7440-50-8
628.741
mg
994919
551527
Leadframe
supplier
alloy
Iron (Fe)
7439-89-6
0.29
mg
459
254
Leadframe
supplier
alloy
Iron Phosphide (FeP)
26508-33-8
0.529
mg
837
464
Leadframe
supplier
metallization
Silver (Ag)
7440-22-4
2.392
mg
3785
2098
supplier
glue or tape
Acrylic resin
9003-01-4
0.294
mg
315451
258
Die attach
supplier
glue or tape
epoxy resin
Proprietary
0.591
mg
634120
518
Die attach
supplier
glue or tape
Diphenol Propane Diglycidyl Ether
1675-54-3
0.047
mg
50429
41
JIG Table A
solder
Lead (Pb)
7439-92-1
Soft solder
supplier
solder
Silver (Ag)
7440-22-4
0.036
mg
14913
32
Soft solder
supplier
solder
Tin (Sn)
7440-31-5
0.024
mg
9942
21
supplier
wire
Gold (Au)
7440-57-5
0.441
mg
131799
387
Bonding wire
supplier
wire
Copper (Cu)
7440-50-8
0.003
mg
897
3
Bonding wire
supplier
wire
Palladium (Pd)
7440-05-3
0.001
mg
299
1
supplier
wire
Aluminium (Al)
7429-90-5
2.901
mg
867005
2545
supplier
mold compound
Epoxy Resin
85954-11-6
38.233
mg
80002
33538
encapsulation
supplier
mold compound
Phenol Resin
26834-02-6
19.116
mg
40000
16768
encapsulation
supplier
mold compound
Silica, vitreous
60676-86-0
416.252
mg
870999
365133
encapsulation
supplier
mold compound
Carbon black
1333-86-4
2.39
mg
5001
2096
encapsulation
supplier
mold compound
Bismuth (Bi)
7440-69-9
1.911
mg
3999
1676
supplier
solder alloy
Tin (Sn)
7440-31-5
3.814
mg
1000000
3346
Copper & its alloys
Die attach
631.952
0.932
Soft solder
2.414
Bonding wire
mg
Level
7000001
Concentration in Concentration in homogeneous product (ppm) material (ppm)
die (s)
Leadframe
19.642
UoM
1140.002
mg
mg
mg
3.346
Bonding wire encapsulation
connections coating
477.902
Solder
3.814
mg
mg
Signature Not Verified Digitally signed by Emilio Castelli Date: 2013.03.20 09:09:41 +01:00
7a-Lead in high melting temperature 2.354 type soldersmg (i.e. lead- based 975145 alloys containing2065 85 % by weight or more lead)
