Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex

TI Designs

Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4F MCU

TI Designs

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Design Resources

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TM4C129XNCZAD

Tool Folder Containing Design Files

TPD4E1U06 SN65HVD256D TPS62177 SN65HVD72DR INA196AIDBVR

Product Folder Product Folder Product Folder Product Folder Product Folder

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• ASK Our E2E Experts WEBENCH® Calculator Tools

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Featured Applications • • •

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Industrial Motor Drives and Industrial Automation Circuit Breakers, Protection Relays, and Panel Mount Multi-Function Power and Energy Meters Substation Automation Products: Remote Terminal Unit (RTU), Protection Relay, Intelligent Electronic Devices (IEDs), Converters, and Gateways Industrial Remote Monitoring: Remote I/O and Data Loggers

Power 5.5 V to 3.3 V TPS62177DQC

5 LEDs

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TM4C129XNCZAD 32-Bit Advanced RISC Machines (ARM) Cortex-M4F Microcontroller (MCU) Based Integrated 10/100 Ethernet Media Access Control (MAC) and Physical Interface Device (PHY) 10/100 Ethernet MAC With Advanced IEEE 1588 Precision Time Protocol (PTP) Hardware and Both Media Independent Interface (MII) and Reduced MII (RMII) Support Provision to Connect to External Boards for Isolated Communication Interface and Power Over Ethernet (POE) On-Board Non-Isolated Controller Area Network (CAN) and RS-485 PHY 50-Pin Connector for External Interface With MII and RMII Ethernet PHY Expansion Connectors for Access to Communication, Analog-to-Digital Converter (ADC), and General Purpose Input and Output (GPIO) Interfaces 1024-KB Flash Memory and 256-KB Single-Cycle System SRAM

Debug Connector

CAN SN65HVD256D

50-Pin Connector

RS485 SN65HVD72DR

Microcontroller TM4C129XNCZAD

USB

EMAC + PHY

Ethernet Connector

ESD TPD4E1U06

MII/RMII/SPI/I2C/UART interfaces

25-MHz Crystal

Spare 10-Pin ADC I/Ps and digital I/ Os

All trademarks are the property of their respective owners. TIDU706A – January 2015 – Revised February 2015 Submit Documentation Feedback


Copyright © 2015, Texas Instruments Incorporated

1

System Description

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An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other important disclaimers and information.

1

System Description A simple and effective design makes Ethernet the most popular networking solution at the physical and data link levels of the Open Systems Interconnection (OSI) model. With high speed options and a variety of media types to choose from, Ethernet is efficient and flexible. In addition, the low cost of Ethernet hardware makes Ethernet an attractive option for industrial networking applications. The opportunity to use open protocols such as TCP/IP over Ethernet networks offers a high level of standardization and interoperability. The result has been an ongoing shift to the use of Ethernet for industrial control and automation applications. Ethernet is increasingly replacing proprietary communications. The CAN-Ethernet Converter is useful in the field of industrial drives monitoring and control as well as supervisory control and data acquisition (SCADA) systems. The same hardware can be used either as a CAN-Ethernet gateway or as a CAN-Ethernet bridge with the changes in the firmware. The CAN-Ethernet gateway is useful for monitoring remote CAN networks over Ethernet or local area network (LAN). The CAN-Ethernet bridge is useful for the transparent coupling of CAN networks through the internet or LAN. The reference design platform demonstrates capabilities of the TM4C129XNCZAD 32-bit ARM CortexM4F MCU. The design supports 10/100 Base-T and is compliant with the IEEE 802.3 standard. The reference design operates from a single power supply (5.5-V input with an on-board regulator of 3.3 V). CAN standard: The CAN bus was developed by BOSCH as a multi-master, message broadcast system that specifies a maximum signaling rate of 1 Mbps. Unlike a traditional network, such as USB or Ethernet, CAN does not send large blocks of data point-to-point between the nodes under the supervision of a central bus master. In a CAN network, many short messages are broadcast to the entire network, which provides data consistency in every node of the system. Although CAN was originally designed for the automotive industry, CAN has become a popular bus in industrial applications as well. CAN bus cable and termination: The High-Speed ISO 11898 standard specifications are given for a maximum signaling rate of 1 Mbps with a bus length of 40 meters and a maximum of 30 nodes. The standard also recommends a maximum un-terminated stub length of 0.3 m. The cable is specified to be a shielded or unshielded twisted-pair with a 120-Ω characteristic impedance (ZO). The standard defines a single line of twisted-pair cable with the network topology as shown in Figure 1. The cable is terminated at both ends with 120-Ω resistors, which match the characteristic impedance of the line to prevent signal reflections. According to ISO 11898, avoid placing RL on a node because the bus lines lose termination if the node is disconnected from the bus.

Figure 1. Details of a Typical CAN Node

2


TIDU706A – January 2015 – Revised February 2015 Submit Documentation Feedback


Design Features

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2

Design Features ITEM

DESCRIPTION

MCU

TM4C129XNCZAD 32-bit ARM Cortex • Built-in 10/100 Ethernet MAC and PHY • Option for interfacing external 10/100 Ethernet PHY

Ethernet Ethernet LEDs

Activity, link, and speed

CAN

SN65HVD256 Turbo-CAN transceiver for high data rates and larger networks (meets ISO 11898-2 requirements)

RS485

Half duplex transceiver up to 250 kbps

Power supply

Single supply - 3.3 V, 0.5-A output

External interface

MII interface connector: 50-pin with an option for power input




3

Block Diagram

3

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Block Diagram The system block diagram of the design is shown in Figure 2. Power 5.5 V to 3.3 V TPS62177DQC

5 LEDs

Debug Connector

CAN SN65HVD256D

50-Pin Connector

RS485 SN65HVD72DR

Microcontroller TM4C129XNCZAD

USB

EMAC + PHY

Ethernet Connector

ESD TPD4E1U06

MII/RMII/SPI/I2C/UART interfaces

25-MHz Crystal

Spare 10-Pin ADC I/Ps and digital I/ Os

Figure 2. System Block Diagram

3.1

MCU The Tiva TM4C129XNCZAD is an ARM Cortex-M4-based microcontroller with a 1024-KB flash program memory, 256-KB SRAM, and 120-MHz operation; USB host, device, and on-the-go (OTG); Ethernet controller, integrated Ethernet PHY, and hibernation module; and a wide range of other peripherals. See the TM4C129XNCZAD microcontroller data sheet for complete device details. This device offers 140 GPIOs and the internal multiplexer allows different peripheral functions to be assigned to these GPIO pads. The Tiva PinMux Utility can be used to quickly develop pin assignments and the code required to configure them.

3.2

Ethernet The TM4C129XNCZAD device supports the following Ethernet interfaces: 1. 10/100 Ethernet interface with internal MAC and PHY 2. Optional 10/100 Ethernet interface with internal MAC and external PHY—the external PHY is interfaced with the MII/RMII interface

3.3

Power Supply The board is powered from an external, single 5.5-V power supply. The TPS62177 (28-V, 0.5-A step-down converter) is used in this design to derive 3.3 V from the external input.

4




Block Diagram

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3.4

Non-Isolated RS485 Interface This design uses the SN65HVD72DR device as the RS-485 transceiver. These type of devices are halfduplex transceivers designed for RS-485 data bus networks. Powered by a 3.3-V supply, the transceivers are fully compliant with the TIA/EIA-485A standard. This device features a wide common-mode voltage range making the device suitable for multi-point applications over long cable runs. SN65HVD72DR devices are optimized for signaling rates up to 250 kbps.

3.5

Non-Isolated CAN Interface The SN65HVD256 Turbo-CAN transceiver is used for high data rates and large networks (the device meets the requirements of ISO 11898-2).

3.6

Expansion Connectors Expansion outputs have been provided for further use as required.

3.7

PCB Dimensions and PCB Physical Layout This reference design has been designed in a small-form factor, four-layer PCB with a dedicated ground and power plane.

3.8

Programming Tiva microcontrollers support the Joint Test Action Group (JTAG) interface for debugging and programming. The designer can place headers on the board and connect them to the JTAG pins on the chip (see the datasheet for pin out information). The use of an external JTAG programmer is required to connect the PC to the board. The Tiva LaunchPad can also be used as an external programmer.

4

Featured Applications The Tiva C Series ARM Cortex-M4 microcontrollers provide top performance and advanced integration. The product family is positioned for cost-effective applications requiring significant control processing and connectivity capabilities such as: • Network appliances, gateways, and adapters • Remote connectivity and monitoring • Security and access systems • Human-machine interface (HMI) control panels • Factory automation control • Motion control and power inversion • Electronic point-of-sale (POS) displays • Smart energy and smart grid solutions • Intelligent lighting control The provided CAN interface can be used for the following applications: • Motor control • Power inverters • Industrial automation • Building automation networks • Automotive applications




5

Circuit Design and Component Selection

5

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Circuit Design and Component Selection The CAN-Ethernet converter is based on the TM4C129XNCZAD device, a 32-bit ARM Cortex-M4F corebased microcontroller. The program that runs on this microcontroller uses lwIP (lightweight IP) stack. LwIP is a widely used, open-source TCP/IP stack designed for embedded systems. LwIP was originally developed by Adam Dunkels at the Swedish Institute of Computer Science and is now developed and maintained by a worldwide network of developers.

5.1

MCU Tiva C Series microcontrollers integrate a large variety of rich communication features to enable a new class of highly connected designs with the ability to allow critical, real-time control between performance and power. The microcontrollers feature integrated communication peripherals along with other highperformance analog and digital functions to offer a strong foundation for many different target uses, spanning from HMI to networked system management controllers. In addition, Tiva C Series microcontrollers offer the advantages of ARM's widely available development tools, System-on-Chip (SoC) infrastructure, and a large user community. Additionally, these microcontrollers use ARM's Thumb®-compatible Thumb-2 instruction set to reduce memory requirements and cost. Finally, the TM4C129XNCZAD microcontroller is code-compatible to all members of the extensive Tiva C Series, providing flexibility to fit precise needs. Some important features of the MCU are as follows: • Performance – ARM Cortex-M4F processor core, 120-MHz operation; 150-Dhrystone million instructions per second (DMIPS) performance, 1024-KB flash memory – 256-KB single-cycle system SRAM, 6KB of electrically erasable programmable read-only memory (EEPROM) • Communication interfaces – Eight universal asynchronous receivers and transmitters (UARTs); four quad synchronous serial interface (QSSI) modules with bi-, quad-, and advanced synchronous serial interface (SSI) support; ten Inter-Integrated Circuit (I2C) modules with four transmission speeds, including high-speed mode; CAN 2.0 A male to B male (A/B) controllers; 10/100 Ethernet MAC and Ethernet PHY with IEEE 1588 PTP hardware support; and a USB 2.0 with host, device, and OTG compatibility with a low-pin interface (ULPI) option and link power management (LPM) support • Analog support – Two 12-bit ADC modules, each with a maximum sample rate of one million samples per second • One JTAG module with an integrated ARM serial wire debug (SWD) • 212-Ball grid array (BGA) package • Operating range (ambient) – Industrial (–40°C to 85°C) temperature range – Extended (–40°C to 105°C) temperature range

5.2

Ethernet The TM4C129X supports 10/100 Mbps Ethernet connections. The board is designed to connect directly to an Ethernet network using RJ45 style connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration creates a simple, elegant, and cost-saving Ethernet circuit design. Example code is available for both the unmanaged internet protocol (uIP) and lwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act as an HTTP server, client, or both. The design and integration of the circuit and microcontroller also enable users to synchronize events over the network using the IEEE1588 precision time protocol.

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5.2.1

LEDs The PHY controls three LEDs as shown in Table 1. Table 1. PHY-LED Control

5.2.2

Pin

Function

PK4

EN0LED0 – Link

PK6

EN0LED1 – Activity

PF1

EN0LED2 – Speed

RJ45 and Isolation Transformer Magnetics are used in Figure 3 with the choke on the side of the PHY. D3 NOTE: Pull up resistors and decoupling cap should be located near U1

D1+ D1-

GND

NC

3.3V

1

1

1

1

C22 1

C24 R10

R9

R13

R11

49.9

49.9

49.9

49.9

TD-

TX-

CHGND

15

EN0TX-

J1

W13

EN0RX+

V13

EN0RX-

RECEIVE

RD+

RX+

TX+_RJ45 TX-_RJ45 RX+_RJ45

14 11

RX-_RJ45

3.3V

GND

75

75

CHASIS

SH1

SH2

RJ45_NOMAG_NOLED

1

75

13 12

R28

C8 1000pF

CHGND

HX1198FNL

C9 4700 pF

1M 2

2

GND

2

9

2

NC3 NC4

1

RX-

NC1 NC2

2 2

4 5

R27

CHASIS

1

RD-

75

GND

2

2

8

R29

1

0.1uF 0.1uF

R26

TX+ TXRX+ TERM1A TERM1B RXTERM2A TERM2B

R34

C11

C13 4.87K

R41

10

2

W15

W15

CMT

1

1

1

RCT

1

7

1 2 3 4 5 6 7 8

1

W13

R17 P16

CMT

1

V14

6

V13 R17 P16

TCT

EN0TX+ GND 3

P17 N16

16

3.3V

V14 P17 N16

TX+

2

2

2

2

GND

V15

2

2

TM4C129XNCZAD V15

TRANSMIT

TD+

2

3.3V

U2C

3 4

0.1uF

2

0.1uF

1 6

T1

1

1

TPD4E1U06DCK

D2+ D2-

2

3.3V

5

NOTE: C40 and C66 must be located near pin 2 and 7 of T1

GND

CHGND

GND

Figure 3. Magnetics for Ethernet Section

5.3

Power Supply As Figure 4 shows, the TPS62177 is programmed to a fixed output voltage of 3.3 V. For the fixed output voltage version, the FB pin is pulled low internally by a 400-kΩ resistor. TI recommends connecting the FB pin to AGND to improve thermal resistance. Current Measure

+5V

L1 TPS62177DQC SW

EN

VOS

3.3V

1

9

R16 1 Ohm, 1%

2

1

2 +5V

HIB

AGND

PGND

1

PG

7

2 2

1

1

22uF, 6.3V

0.1uF

1 1

100K GND

0

GND

GND

GND

GND

330

R56 2 2

2

2

330

1

+5V

1

3.3V

0.1uF

D9 1SMB5915BT3G 3.9V

R22

11 GND

R12

C42

1

C37

C36

R51 22uF, 6.3V

1

0

GND

1

C6

2

6

2

NC

5

2

R49

FB

2

HIB 1

4

1K 2

2

2

2.2K

SLEEP

1

8

3.3V

10uH

10

1

R21

PWPD

R19

2.2uF 50V

2

3

1

C43

1

1

VIN

TL1 TL3 TL2

U5 2

IND-WE-7440

1

D15

1

D8

GND

GND

Figure 4. Power Supply Section TIDU706A – January 2015 – Revised February 2015 Submit Documentation Feedback



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5.3.1

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External Component Selection for the Power Supply The external components must fulfill the needs of the application, but also the stability criteria of the control loop of the device. The TPS62175/7 is optimized to work within a wide range of external components. The inductance and capacitance of the LC output filter must be considered together, creating a double pole that is responsible for the corner frequency of the converter.

5.3.2

Layout Considerations for the Power Supply The input capacitor must be placed as close as possible to the IC pins (VIN and PGND). The inductor must be placed close to the SW pin and connect directly to the output capacitor—minimizing the loop area between the SW pin, inductor, output capacitor, and PGND pin. The sensitive nodes like FB and VOS must be connected with short wires instead of nearby high dv/dt signals (for example, the SW pin). The feedback resistors must be placed close to the IC and connect directly to the AGND and FB pins.

5.3.3

Thermal Data for the Power Supply The TPS62175/7 device is designed for a maximum operating junction temperature (Tj) of 125°C. Therefore the maximum output power is limited by the power losses. As the thermal resistance of the package is given, the size of the surrounding copper area and a proper thermal connection of the IC can reduce the thermal resistance.

5.4

Non-Isolated CAN Interface 2 1

CANH CANL

J6

CANH

3.3V

CANH

U4 CAN1TX CAN1RX

CAN1TX CAN1RX

1 4

+5V

8 5 3

TXD RXD

CANH CANL

7 6

R45 120

CANL

S VRXD VCC

GND

CANL

2

SN65HVD256D

C30 0.1µF GND

GND

GND

Figure 5. CAN Interface As Figure 5 shows, the CAN transceiver SN65HVD256 is used to provide the differential transmit and differential receive capabilities to the CAN controller of the MCU. This CAN transceiver meets the ISO1189-2 High Speed CAN Physical Layer standard. The transceiver is designed for data rates in excess of 1 Mbps for CAN in short networks, and enhanced timing margin and higher data rates in long and highly-loaded networks. The device provides many protection features to enhance device and CAN network robustness.

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5.5

Expansion Connectors In the design, peripherals that are not currently used, such as SPI, UART, and I2C signals, are terminated on the 50-pin SDCC connector as Figure 6 shows.

2

1

+5V

R62

0

J9

I2C8SCL I2C8SDA SPI3CS SPI3SCK SPI3SDO SPI3SDI CAN0RX CAN0TX RESET_N

1

SPI0CS SPI0SCK SPI0SDO SPI0SDI U5TX U5RX U7TX U7RX EN0TXER

1_5V_PS 3.3V

R57

2

R58

GND

OUT

U6

VIN+

ERM8-025-05.0-L-DV-K-TR

4

5

0.1

GND

V+



VIN-

TX_CLK RXD3 RXD2 RXD0 RXD1 RX_DV RX_CLK RX_ER EN0INTRN PG0/PPS

2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50

GND


1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49

TX_EN TXD0 TXD1 TXD2 TXD3 COL CRS MDIO MDC

0


C44

MCU_ISENSE

3

2

1

INA196AIDBVR 0.1µF

MCU_ISENSE GND

GND

Figure 6. 50-Pin SDCC Connector An option to measure the consumption of 3.3 V supplied to the external PHY interface has been provided. The same 50-pin has CAN, UART, SPI, and I2C signals. 5.5.1

Interface for Isolated UART and CAN: Figure 7 shows the connector that can be used to interface with the high-efficiency isolated CAN and Process Field Bus (PROFIBUS) interface. J10 1 2 3 4 5 6

CAN1RX CAN1TX U3TX U3RTS U3RX

HEADER_TMM-103-01-G-D-RA GND

Figure 7. Interface for Isolated UART and CAN




9


5.5.2

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Optional Interface for USB J3 SPARE1

3.3V

SPARE2 SPARE3

R18 1

2

EXTDBG

10k

SPARE4 I2C6SCL

1

2

3

4

5

6

7

8

9

10

I2C6SDA ADC3 ADC2 ADC1 ADC0

HEADER_2041501

1

Figure 8. Interface for ADC and Spare I/Os

GND

C3

2

3300pF J5

ZX62R-AB-5P $$$22985

7

8

G

D-

ID

9

D+

11

6

VB

10

R7

1

2

1M

GND

5

4

3

2

1

CHGND GND

+VBUS

D4

1

+5V

1

C17

2

D5

1

C21 4.7UF 6.3V

2

2

D16 1

U3 5

VIN

GND

USB_EN4

USB_EN

R42

2

GND 1 3

OC

USB_EN GND

USB_EN USB_PLFT

R35 R36 R14 R15

USB0DP

USB0DM USB0ID USB0VBUS USB0EPEN USB0PLFT

33 33 33 33


TP19

TPS2051BDBVT

TP20

GND

1

1

10K

OUT

EN

2

GND

2

USB0DP

2

ACTIVITY(GREEN)

1

4.7UF 6.3V

GND

R44 10K 2

3.3V

Figure 9. Interface for USB

5.5.3

Programming Connector: The JTAG interface has been provided for programming as shown in Figure 10. PIN

FUNCTION

TCK - JTAG

JTAG test clock signal. This pin is also the SWCLK signal for TCK serial wire debug (SWD) connections.

TMS - JTAG

JTAG test mode select. This pin is also the SWDIO signal for TMS SWD connections.

TDO - JTAG

JTAG test data out. This pin is also the SWO signal for SWD connections.

TDI EXT-DBG RESET GND

JTAG test data in. Pull this pin low to tri-state the on-board ICDI drive signals. This action prevents the ICDI from interfering with an external debug-in connection. Target reset pin. Ground pin of MCU. Connect this pin to the external JTAG programmer ground pin. In situations where the LaunchPad is used as a programmer, this pin must be connected to the ground pin of the LaunchPad.

1

1 2

2

R20 10K 2

R17 10K

3.3V

R54 10K

R52 10K

2

1

1

3.3V

J7

EXTDBG

EXTDBG

1

2

3

4

5

6

7

8

9

10

TMS TCK TDO TDI T_TRST

HEADER_2041501

GND

Figure 10. Programming Connector 10




Software Description

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6

Software Description The software provided for the CAN-Ethernet converter performs the CAN-Ethernet gateway operation. Using a PC and the CAN-Ethernet converter, the user can send and receive messages through the Telnet interface (using a free terminal emulator application such as Tera Term). Telnet is a client-server protocol based on a reliable connection-oriented transport. Typically, this protocol is used to establish a connection to TCP port number 23, where a Telnet server application (telnetd) is listening. Tera Term is an opensource, free, software-implemented terminal emulator program. The example software provides testing of the hardware by simple character transfers via telnet to the CAN bus and vice versa. The software is tested at different CAN baud rates of 10 kbps, 500 kbps, and 1 Mbps.




11

Test Results

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7

Test Results

7.1

Functional Testing Table 2. Functional Testing Values

7.2 7.2.1

Clock

25 MHz

VCC (3 to 3.6 V)

3.31 V

Internal 1.55 V

1.55 V

MII interface

OK

Link and activity LED

OK

CAN-Ethernet Gateway Testing Test Setup Figure 11 shows the test setup. • A 5.5-V DC power supply powers the CAN-Ethernet converter. • This board must be programmed with the CAN to Ethernet software provided. (Note: To program the TM4C microcontrollers, the user can use the ARM JTAG debugger or the TM4C LaunchPad as a JTAG programmer. For programming, the user can use LM Flash Programmer GUI or Code Composer Studio (CCS) available on www.ti.com). • Use a standard RJ45 cable to connect the CAN-Ethernet converter to the PC. • Use the DK-TM4C123G evaluation board available from TI and program the board with the CAN example software provided in the TivaWare software installation. (Note: TivaWare is available for free download on the TI website. When installing in the C:\ drive of the PC, the CAN example software can be found in the folder C:\ti\TivaWare_C_Series-2.1.0.12573\examples\boards\dk-tm4c123g\can). This sample program enables sending and receiving of characters via the UART to the CAN bus. This board must be connected to the USB port of the PC. If TivaWare has been previously installed on the PC, the necessary drivers will automatically install and update upon connecting the board to the PC. • Connect a 120-Ω resistor across the CANH and CANL terminals of the DK-TM4C123G board. • Connect the CAN outputs of the CAN-Ethernet converter and the DK-TM4C123G evaluation board using a twisted-pair cable. • Download and install the free Tera Term software to use as a terminal emulator for the testing. • Download and install the free Wireshark network analyzer. For installation, right-click on the downloaded .exe file and click Run as administrator. RJ45 Cable (Connecting PC to CANEthernet Converter) USB Micro-B-plug-to-USB-A plug cable (connects to PC as a USB device)

120- Resistor

5.5 V DC Power Supply (on J8)

DK-TM4C123G Development Board (Connected to USB port of PC, runs UART-CAN software example from TivaWare)

Twisted pair connecting CANH and CANL terminals (on J6)

Figure 11. Test Setup for Testing CAN-Ethernet Converter 12




Test Results

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7.2.2 •

Test Procedure Assigning the IP address to PC Ethernet port (Figure 12): – The user must manually assign an IP address to the PC, as the gateway is directly connected to the PC. Click on the Windows Start button and type view network connections in the Search programs and files box. Click on View network connections under the Control Panel heading. – Find the correct Local Area Connection for the Ethernet port and right-click on it. Select Properties. – Click on Internet Protocol Version 4 and then click the Properties button. – Click on Use the following IP address. Select and assign a compatible address to the port. The address could be 169.254.31.001. The Subnet mask automatically defaults to 255.255.0.0. – Click OK. – If using a laptop, be sure to disable the wireless LAN connection.

Figure 12. Assigning the IP Address




13

Test Results

•

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Starting the test: – Power up the CAN-Ethernet converter with the Ethernet connected to the PC and run the Wireshark program. – The CAN-Ethernet software uses auto IP, so the PC automatically assigns an IP to the CANEthernet converter. – As the Wireshark screen capture from Figure 13 shows, the CAN-Ethernet converter requests the allocation of an IP address. – The PC allocates the IP address within five seconds. The same allocated address can be seen from the Wireshark screen capture. For example, in Figure 13 the IP address allocated to the CANEthernet board is 169.254.254.255.

Figure 13. Wireshark Capture • •

Power up the DK-TM4C123G device by connecting to the USB of the PC. Open the Tera Term program for creating a new connection, as Figure 14 shows. Select TCP/IP and Telnet. Type in the IP address allocated to the CAN-Ethernet converter in the Host field. For example, if the IP address allocated is 169.254.254.255, enter that as the address.

Figure 14. Tera Term Telnet Connection

14




Test Results

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•

Open the Tera Term again for creating a new connection. Now select Serial and select the port on which the USB-COM driver of the DK-TM4C123G device is mounted. The port number becomes visible in the Serial selection box. As Figure 15 shows, set the Baud rate field to "115200" , the Data field to "8 bit", the Parity field to "none", the Stop field to "1 bit", and the Flow control field to "none".

Figure 15. Serial Communication Settings •

The user can now type in either the Telnet Tera Term connection or the Serial COM Tera Term connection and observe the characters transmitting to the other terminal. Basically, through the Serial COM Tera Term window, the DK-TM4C123G board receives the data from UART and sends the data to the CAN bus. The CAN-Ethernet board receives the data from the CAN bus and sends the data to Ethernet. Similarly, the data can flow the other direction, as well. NOTE: On modifying the (CAN-Ethernet Gateway) software: The example software is tested with Code Composer Studio V6. If the user wants to open, modify, or recompile the project, installing the CCS installation is required. The example software also uses the resources from TivaWare—the compiled project refers to the TivaWare installation at the default installation path C:\ti\TivaWare_C_Series-2.1.0.12573. The options and settings of the project require updating if the TivaWare version number or the installation path is different.

7.3

Electromagnetic Interference-Radiated Emission The test distance for radiated emission from the equipment under test to antenna is 10 m. The test was performed in a semi-anechoic chamber, which conforms to the Volumetric Normalized Site Attenuation (VNSA) for ten-meter measurements. Table 3. Specifications for Radiated Emissions FREQUENCY RANGE

CLASS A LIMITS QUASI-PEAK

CLASS B LIMITS QUASI-PEAK

30 MHz to 230 MHz and 230 MHz to 1 GHz

40 and 47 dB μV/m

30 and 37 dB μV/m

Table 4. Observation for Radiated Emissions REQUIREMENTS

FREQUENCY

RESULT

EN 55011: 2009 + A1: 2010, Class A

30 MHz to 1000 MHz

Pass




15

Test Results

7.3.1

www.ti.com

Test Result Graphs The test is done with the TM4C129XNCZAD 32-bit ARM Cortex-M4F MCU with the internal MAC and PHY enabled. Figure 16 and Figure 17 show the graphs for horizontal and vertical polarization, respectively.

Figure 16. Horizontal Polarization

Figure 17. Vertical Polarization

16




Test Results

www.ti.com

7.4

Electro Static Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Compatibility (EMC) Recommendations and Design Guidelines The following list provides recommendations to improve EMI performance: 1. Use a guard ring for the crystal. 2. Use a metal-shielded RJ-45 connector to connect the shield to chassis ground. 3. Use magnetics with integrated, common-mode choking devices with the choke on the side of the PHY (for example, the Pulse HX1198FNL). 4. Do not overlap the circuit and chassis ground planes, keep them isolated. Connect the chassis ground and system ground together using one capacitor with 4700 pF, 2 kV, 10% tolerance, and an X7R type.




17

Design Files

www.ti.com

8

Design Files

8.1

Schematics R3

3.3V

R1

1

1

2.2K R2

2

2

2.2K U7TX U7RX RX_CLK

PG0/PPS

U7TX U7RX RX_CLK PG0/PPS

P4 R2 R1 T1 K3 L2 M1 M2 V5 R7 T14 N15 L19 L18 K19 K18 C12

A10

P4 R2 R1 T1 K3 L2 M1 M2 V5 R7 T14 N15 L19 L18 K19 K18 C12

C18 B18 B16 A16 B3 B2 E18 F17 B7 A8 T8 N5 N4 N2 N1 P3 P2 U8 V8 W9 R10 V9 T13

2 2

MCU_ISENSE PQ7/LED_G ADC3 ADC2 ADC1 ADC0

R43

EN0RREF_CLK

33

TX_CLK

H16 E10 USB0DP USB0DM USB0VBUS USB0ID USB0EPEN USB0PLFT

1

1

1

2

GND

2 1

1

2

2 V18 V19 W18 W19 E13 C5

2

0.01uF

1

0.01uF

C31

C33

0.1uF 0.1uF 2

C28

0.1uF

1

C27

0.1uF

2

C41

2

C39

2

1

GND

1

GND

L10 L11 J8 J9 L12 M11 M12 P10 K11 K12 K7 K8 G10 H9 J10

GND

GND 3.3V

C35

C38

0.1uF

0.1uF

C40

C23

C5

0.1uF 0.1uF 0.1uF

V18 V19 W18 W19 E13 C5

1

MCU_ISENSE PQ7/LED_G ADC3 ADC2 ADC1 ADC0

L10 L11 J8 J9 L12 M11 M12 P10 K11 K12 K7 K8 G10 H9 J10

1

GND

I2C8SCL I2C8SDA

L8 L9 M8 M9 N10 V1 W1 W2 M10 K10 K13 K14 K6 K9 F10 J11 J12 H10 H11 H12 A1 A18 A19 A2 B1 B19

2

1

C15 33pF

G4

1

1

C34 0.01 uF

GND 3.3V

1

L8 L9 M8 M9 N10 V1 W1 W2 M10 K10 K13 K14 K6 K9 F10 J11 J12 H10 H11 H12 A1 A18 A19 A2 B1 B19

2

2.2K

I2C8SCL I2C8SDA

2 G4

C14 33pF

C26 1uF

2

2.2K R59

C29 0.01UF

2

2

R61

1

F3

2

Y1 25MHz

3.3V

U5RX U5TX 2

E18 CAN1RX F17 CAN1TX B7 A8 T8 N5 N4 N2 N1 P3 P2 U8 V8 W9 R10 V9 T13

D18

0

1.0Meg

U5RX U5TX

WAKE

C32 1uF 3.3V

F3

1

HIB

F4 G5

R4

R5

USB0DP USB0DM USB0VBUS USB0ID USB0EPEN USB0PLFT

D18

HIB WAKE

M17 U18

C25 0.1uF 2

GNDX2

GND

F4 G5

1

GND

E19 D19

RESET_N

B17 G16 H19 G18 J18 H18 G19 B12 D8 B13 C18 B18 B16 A16 B3 B2

E19 D19

M17 U18

1

MOSC0 MOSC1

T18 T19 R18

2

R37

T18 T19 R18

R32 0

1

GNDX

FB1 1000 OHM

R33 10K

2

GND

0.1uF

1

GND

P19

2

2

XOSC0

C48 33pF

0

RESET_N

P19

2

C47 33pF

P18

1

C46 33pF

RESET P18

51 2 C12

TM4C129XNCZAD

1

U2B

1

C45 33pF

1

VBAT

1

R39 10K

C19 1uF

1

1 1 RESET

TXD0 TXD1 TXD2 TXD3

PF1/LED2

0 R31

2

0

R38

R30 NOTE: To guarantee risetime requirements

GND

H16 E10

VDDC_1P2V_INT

C20 1uF

C16

1

B17 G16 H19 G18 J18 H18 G19 B12 D8 B13

3.3V

C18

C4

2.2 uF

0.1uF 0.01 uF 2

U10 R13 W10 V10 B8 C2 C1 A5 F18 E17 F2 F1

MII/RMII External Ethernet PHY

1

CAN0RX W10 CAN0TX V10 PP6 B8 PD0/AIN15 C2 PD1/T0CCP0 C1 PE4 A5 U3RTS F18 U3CTS E17 I2C6SCL F2 I2C6SDA F1

3.3V T_TRST

2

CAN0RX CAN0TX PP6 PD0/AIN15 PD1/T0CCP0 PE4 U3RTS U3CTS I2C6SCL I2C6SDA

MDIO RX_DV RX_ER TX_CLK TX_EN EN0TXER EN0INTRN COL CRS RXD0 RXD1 RXD2 RXD3 EN0RREF_CLK

1

U10 R13

2.2k

B4 T2 C8 E7 T6 U5 V4 W4 C6 B6

J1 J2 K1 K2 A13 B9 H17 F16 K5 U12 C10 B11 A11 U2 V2 G15 D12 D13 B14 A14 M4 D2 D1 A17 A7 M3 H3 H2 G1 G2

MDIO RX_DV RX_ER TX_CLK R46 33 TX_EN EN0TXER EN0INTRN COL CRS RXD0 RXD1 RXD2 RXD3 EN0RREF_CLK 0 2TXD0 1R40 0 2TXD1 1R47 0 2TXD2 1 R6 0 2TXD3 1 R8 MDC MDC PF1/LED2

2

R60

B4 T2 C8 E7 T6 U5 V4 W4 C6 B6

A4

J1 J2 K1 K2 A13 B9 H17 F16 K5 U12 C10 B11 A11 U2 V2 G15 D12 D13 B14 A14 M4 D2 D1 A17 A7 M3 H3 H2 G1 G2

T7 U14 V12 V11 M16 T12 D6 N18 N19 W12 U15 V17 U19 M18 K17 K15 V16 W16 W6 V6

2

U3RX U3TX SPI0SCK SPI0CS SPI0SDO SPI0SDI

U3RX U3TX SPI0SCK SPI0CS SPI0SDO SPI0SDI

A4

D7 B10 B5

T7 U14 V12 V11 M16 T12 D6 N18 N19 W12 U15 V17 U19 M18 K17 K15 V16 W16 W6 V6

1

EXTDBG

EXTDBG

D7 B10 B5

E2 E3 H4 U6 V7 W7 R3

TM4C129XNCZAD

2

SPARE4 SPARE5 SPARE6

SPARE4 SPARE5 SPARE6

E2 E3 H4 U6 V7 W7 R3

V3 W3 B15 C15 D14 C14

2

SPI3CS SPI3SCK SPI3SDO SPI3SDI SPARE1 SPARE2 SPARE3

SPI3CS SPI3SCK SPI3SDO SPI3SDI SPARE1 SPARE2 SPARE3

V3 W3 B15 C15 D14 C14

2

DEBUG_RX DEBUG_TX TCK TMS TDI TDO

1

U2A

2.2k DEBUG_RX DEBUG_TX TCK TMS TDI TDO

GND

GND

GND

GND

SW1

CAN1RX CAN1TX

RESET

RESET 1 3

2 4

GND

A10

Figure 18. Microcontroller Schematic

18

Compact CAN-to-Ethernet Converter Using 32-Bit ARM® Cortex™-M4F MCU Copyright © 2015, Texas Instruments Incorporated


Design Files

www.ti.com D3 NOTE: Pull up resistors and decoupling cap should be located near U1

D1+ D1-

GND

NC

3.3V

1

49.9

49.9

R13

R11

TD+

2

6

TD-

TX-

CHGND

15

W13

EN0RX+

V13

EN0RX-

RD+

RECEIVE

RX+

TX+_RJ45 TX-_RJ45 RX+_RJ45

14 11

RX-_RJ45

3.3V

GND

2

75

75

CHASIS

SH2

RJ45_NOMAG_NOLED

1

75

13 12

R28

C8 1000pF

CHGND

HX1198FNL

C9 4700 pF

1M 2

2

GND

2

NC3 NC4

1

NC1 NC2

9

R27

SH1

1

RX-

2 2

4 5

R26

CHASIS

R34

RD-

75

GND

2

2

8

R29

1

0.1uF 0.1uF

2

C11

C13 4.87K

R41

CMT

1

1

1

RCT

TX+ TXRX+ TERM1A TERM1B RXTERM2A TERM2B

10

1

7

W15

W15

1 2 3 4 5 6 7 8

1

W13

R17 P16

CMT

J1

EN0TX-

V14

V13 R17 P16

TCT

EN0TX+ GND 3.3V

V14 P17 N16

16

1

49.9

3

P17 N16

TX+

2

49.9

2

2

2

GND

V15

2

TM4C129XNCZAD V15

TRANSMIT

0.1uF

3.3V

U2C

3 4

2

R9

2

R10

1

1

1

1

C22

0.1uF

1 6

T1

1

1

TPD4E1U06DCK

C24

D2+ D2-

2

3.3V

5

NOTE: C40 and C66 must be located near pin 2 and 7 of T1 1

GND

GND

C3

CHGND

GND

2

3300pF J5

ZX62R-AB-5P $$$22985

D-

VB

7

G

9

ID

11

6

D+

10

1

R7

2

1M

RXD3 TXD2

8 GND

USB_EN4

1

10K

R42

2

2

OUT

EN

OC

LED1 LED2

2 GND

2

LED2

GND 1 3 USB_EN

GND

USB_EN USB_PLFT

R35 R36 R14 R15

33 33 33 33

D12

1

1

R50

2

SPEED(AMBER)

USB0DP



TP19

TPS2051BDBVT

LED2 2

330

USB0DP

VIN

2

LED0

2

D16

2 5

GND USB_EN

LED0 LED1 LED2

2

0 0

5

4

3

2

1 1

1

4.7UF 6.3V

U3

1

R48

2

0

D5 1

2

ACTIVITY(GREEN)

R23

D4 1

C17 C21 4.7UF 6.3V

1

GND

+VBUS +5V

1

TXD2 PF1/LED2

PF1/LED2

CHGND

R24

RXD3

LED1

LED1 2

D14

R55 1

1

2

330

TP20

LED0

GND

LED0 2

D13

R53 1

1

LINK(RED)

2

1

1

330 GND

R44 10K

3.3V

2

GND

Figure 19. 10/100 Ethernet USB Schematic



19

Design Files

www.ti.com 2 1

CANH CANL

2 1

RS485-A RS485-B

J6

J2

RS485-A CANH

3.3V

CANH

CAN1TX CAN1RX

CAN1TX CAN1RX

1 4

+5V

8 5 3

7 6

TXD CANH RXD CANL

U3TX

CANL

VRXD VCC GND

1 2

U3RX U3RTS

R45 120

S

RS485-A

U1

U4

U3TX

4 3 8

CANL

R RE D DE VCC

A B

R25 120

6 7

RS485-B GND

RS485-B

3.3V

5

SN65HVD72DR

2

SN65HVD256D

C30

GND

0.1µF GND

C1 10µF

C7 0.1µF

C2 0.1µF

C10 0.1µF

GND

GND GND

3.3V

RS485-A

D2 DESD1P0RFW-7

1 2 3 4 5 6

3

1

D7 DESD1P0RFW-7

2

2 RS485-B

3

1

CANL

3

1

1

CANH

2

2

J10

D6 DESD1P0RFW-7

3

D1 DESD1P0RFW-7

CAN1RX CAN1TX U3TX U3RTS U3RX

HEADER_TMM-103-01-G-D-RA GND GND

Figure 20. CAN, RS485 Schematic

20



Design Files

www.ti.com +5V

D10 1

AK

2 1

2

2

DFLS1200-7

J8

+5V 3

D11 DESD1P0RFW-7 1

GND

+5V

1

GND

TP9

TP11

TP16

TP17

TP18

TP13

TP12

TP6

TP14 TP7

TP8

TP3 TP5

TP2 TP1

TP4 2

TP10

TP15

R62

0

J9

SPI0CS SPI0SCK SPI0SDO SPI0SDI U5TX U5RX U7TX U7RX EN0TXER 1

I2C8SCL I2C8SDA SPI3CS SPI3SCK SPI3SDO SPI3SDI CAN0RX CAN0TX RESET_N SPI0CS SPI0SCK SPI0SDO SPI0SDI U5TX U5RX U7TX U7RX EN0TXER

1_5V_PS 3.3V

R57

2

R58

0.1

ERM8-025-05.0-L-DV-K-TR

GND

OUT

U6

GND

4 VIN+



V+

U5TX U5RX U7TX U7RX EN0TXER


2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50

5

SPI0CS SPI0SCK SPI0SDO SPI0SDI

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49


VIN-



GND


0


C44

MCU_ISENSE

3

2

1

INA196AIDBVR 0.1µF

MCU_ISENSE GND

GND

Figure 21. MII and RMII Interface Schematic



21

Design Files

www.ti.com Current Measure

+5V

L1

SW

EN

VOS

1

9

2

1

2 +5V

1

VIN

3.3V

R16 1 Ohm, 1%

IND-WE-7440

TPS62177DQC

HIB

AGND

PG PGND

1

22uF, 6.3V 1

2

2

11 GND

1

1

0.1uF

1 1

100K GND

GND

GND

GND

1

330 2 2

2

2

R56

1

+5V

330

R12

22uF, 6.3V

0

GND

3.3V

0.1uF

D9 1SMB5915BT3G 3.9V

R22

0

GND

1

C36

C42

R51 2

NC

C6

7

C37

2

2

6

2

FB

2

R49

SLEEP

2

HIB 1

4

1K

2

2

2.2K

5

1

8

3.3V

10uH

10

1

R21

PWPD

R19

1

3

1

1

C43 2.2uF 50V

TL1 TL3 TL2

U5 2

1

D15

1

D8

GND

GND

Figure 22. Power Supply Schematic J3 SPARE1

3.3V

SPARE2 SPARE3

R18 1

10k

2

EXTDBG

SPARE4 I2C6SCL

1

2

3

4

5

6

7

8

9

10

I2C6SDA ADC3 ADC2 ADC1 ADC0

HEADER_2041501

1

R54 10K

R52 10K

2

1

1

2

R20 10K 2

R17 10K

3.3V

2

1

3.3V

J7 1 2

DEBUG_RX DEBUG_TX

EXTDBG

EXTDBG

J4

1

2

3

4

5

6

7

8

9

10

TMS TCK TDO TDI T_TRST

HEADER_2041501

GND

Figure 23. Spare and Debug Schematic 22



Design Files

www.ti.com

8.2

Bill of Materials To download the bill of materials (BOM), see the design files at TIDA-00203. Table 5. BOM

FITTED

QTY

Fitted

1

C1

REFERENCE

CAP, CERM, 10uF, 6.3V, +/-20%, X5R, 0603

PART DESCRIPTION

MANUFACTURER Kemet

MANUFACTURER PART # C0603C106M9PACTU

Fitted

3

C2, C7, C10

CAP, CERM, 0.1uF, 16V, +/-10%, X5R, 0603

MuRata

GRM188R61C104KA01D

Fitted

1

C3

Capacitor, 3300pF, 50V, 10%, X7R, 0603

TDK Corporation

C1608X7R1H332K

Fitted

4

C4, C27, C28, C34

Capacitor, 0.01uF 25V, 10% 0402 X7R

Taiyo Yuden

TMK105B7103KV-F

Fitted

16

C5, C11, C12, C13, C16, C22, C23, C24, C25, C35, C37, C38, C39, C40, C41, C42


TDK Corporation

C1608X7R1H104M

Fitted

1

C6

Capacitor, 22uF 6.3V 20% X5R 0805

TDK Corporation

C2012X5R0J226M

Fitted

1

C8

CAP CER 1000PF 2KV 20% X7R 1210

KEMET

C1210C102MGRACTU

Fitted

1

C9

Capacitor, 4700pF, 2kV, 10%, X7R, 1812

AVX

1812GC472KAT1A

Fitted

6

C14, C15, C45, C46, C47, C48

CAP, CERM, 33pF, 50V, +/-5%, C0G/NP0, 0402

MuRata

GRM1555C1H330JA01D

Fitted

2

C17, C21

Capacitor, 4.7uF, 6.3V, 10% 0805, X5R

Taiyo Yuden

JMK212BJ475KG-T

Fitted

1

C18

Capacitor, 2.2uF, 16V, 10%, 0603, X5R

Murata

GRM188R61C225KE15D

Fitted

4

C19, C20, C26, C32

Capacitor, 1uF , X5R, 10V, 0402

TDK Corporation

C1005X5R1A105M050BB

Fitted

3

C29, C31, C33


Taiyo Yuden

EMK105B7104KV-F

Fitted

2

C30, C44

CAP, CERM, 0.1uF, 25V, +/-5%, X7R, 0603

AVX

06033C104JAT2A

Fitted

1

C36

Capacitor, 22uF 6.3V 20% X5R 0805

TDK Corporation

C2012X5R0J226M/1.25

Fitted

1

C43

Capacitor, 2.2uF 50V 10% X5R 0805

TDK Corporation

C2012X5R1H225K

Fitted

5

D1, D2, D6, D7, D11

Diode, P-N, 70V, 0.2A, SOT-323

Diodes Inc

DESD1P0RFW-7

Texas Instruments

TPD4E1U06DCK

Fitted

1

D3

Quad Channel High Speed ESD Protection Device, DCK0006A

Fitted

3

D4, D5, D16

Diode, 5.6V ESD Suppressor 0402

Epcos

B72590D0050H160

Fitted

2

D8, D14

LED, Green 565nm, Clear 0805 SMD

Lite on

LTST-C171GKT

Fitted

1

D9

Diode, Zener, 3.9V, 550mW, SMB

ON Semiconductor

1SMB5915BT3G

Fitted

1

D10

Diode, Schottky, 200V, 1A, PowerDI123

Fitted

2

D12, D15

LED AMBER CLEAR 0805 SMD

Fitted

1

D13

LED, Red 630nm, Clear 0805 SMD

Fitted

1

FB1

FERRITE CHIP 1000 OHM 300MA 0603

Fitted

6

FID1, FID2, FID3, FID4, FID5, FID6

Fiducial mark. There is nothing to buy or mount.

Fitted

6

H1, H2, H3, H4, H5, H6

Machine Screw, Round, #4-40 x 1/4, Nylon, Philips panhead

Fitted

1

J1

Connector, RJ45 NO MAG, shielded THRU HOLE

Fitted

4

J2, J4, J6, J8

Terminal Block, 4x1, 2.54mm, TH


Diodes Inc.

DFLS1200-7

Lite on

LTST-C170AKT

Lite on

LTST-C171EKT

TDK Corporation

MMZ1608B102C

N/A

N/A

B&F Fastener Supply

NY PMS 440 0025 PH

TE conncetivity

6116526-1

On Shore Technology Inc

OSTVN02A150


23

Design Files

www.ti.com

Table 5. BOM (continued) FITTED

QTY

Fitted

2

J3, J7

Header, 2X5 2mm spacing

Fitted

1

J5

Connector, USB micro AB Receptacle Reversed SMD

Fitted

1

J9

Not Fitted

0

Fitted

1

24

REFERENCE

PART DESCRIPTION

MANUFACTURER

MANUFACTURER PART #

Harwin Inc

M22-2020505

HIROSE ELECTRIC CO. LTD.

ZX62R-AB-5P

CONN MICRO HS TERM STRP HDR 50 POS

Samtec

ERM8-025-05.0-L-DV-K-TR

J10

Header, 2mm, Low Profile 2x3

Samtec

TMM-103-01-G-D-RA

L1

Inductor 10uH, SMD 2.8x2.8mm, 0.5A, 0.47 Ohm

Wurth Electronics Inc

744029100

000 per roll"

Brady

Not Fitted

0

LBL1

Thermal Transfer Printable Labels, 0.650 W x 0.200" H - 10

Fitted

5

R1, R2, R19, R59, R61

Resistor, 2.2K OHM 1/10W 5% 0603 SMD

Vishay-Dale

CRCW06032K20JNEA

Fitted

2

R3, R60

RES, 2.2k ohm, 5%, 0.063W, 0402

Vishay-Dale

CRCW04022K20JNED

Fitted

12

R4, R6, R8, R23, R24, R30, R32, R37, R38, R40, R47, R48

Resistor, 0 ohm, 1/10W, 5%, 0402

Panasonic Electronic Components

ERJ-2GE0R00X

Not Fitted

0

R5

RES, 1.0Meg ohm, 5%, 0.063W, 0402

Vishay-Dale

CRCW04021M00JNED

Fitted

1

R7

Resistor, 1M OHM 1/10W 5% 0603 SMD


ERJ-3GEYJ105V

Fitted

4

R9, R10, R11, R13

Resistor, 49.9 OHM 1/10W 1% 0603 Thick


ERJ-3EKF49R9V

Fitted

2

R12, R56

Resistor, 330 ohm, 1/10W, 5%, 0402


RC0402FR-07330RL

Fitted

5

R14, R15, R35, R36, R46

RES, 33 ohm, 5%, 0.063W, 0402

Fitted

1

R16

Resistor, 1 OHM 1/10W 1% 0603, Thick

Fitted

8

R17, R18, R20, R33, R39, R44, R52, R54

Resistor, 10k ohm, 1/10W, 5%, 0402 Thick Film

Vishay-Dale

CRCW040233R0JNED


ERJ-3RQF1R0V

Yageo America

RC0402FR-0710KL ERJ-3GEYJ102V

Fitted

1

R21

Resistor, 1K Ohm, 1/10W, 5%, SMD, Thick


Fitted

4

R22, R49, R58, R62

Resistor, 0 OHM 1/10W 0603 SMD


ERJ-3GEY0R00V

Fitted

2

R25, R45

RES, 120 ohm, 1%, 0.25W, 1206

Yageo America

RC1206FR-07120RL

Fitted

4

R26, R27, R29, R34

Resistor, 75 Ohm, 1/10W, 1%, SMD, Thick


ERJ-3EKF75R0V

Fitted

1

R28

RES 1M OHM 5% 1206 TF


ERJ-8GEYJ105V

Fitted

1

R31

Resistor, 51 ohm, 1/10W, 5%, 0402


ERJ-2GEJ510X

Fitted

1

R41

Resistor, 4.87K Ohm, 1/10W, 1%, SMD, Thick


ERJ-3EKF4871V



Design Files

www.ti.com

Table 5. BOM (continued) FITTED

QTY

REFERENCE

PART DESCRIPTION

MANUFACTURER

MANUFACTURER PART #


ERJ-3GEYJ103V

Vishay-Dale

CRCW040233R0JNED

Fitted

1

R42

Resistor, 10K OHM 1/10W 5% 0603 SMD

Not Fitted

0

R43

RES, 33 ohm, 5%, 0.063W, 0402

Fitted

3

R50, R53, R55

Resistor, 330 OHM 1/10W 5% 0603 SMD


ERJ-3GEYJ331V

Fitted

1

R51

Resistor, 100K OHM 1/10W 5% 0603 Thick


ERJ-3GEYJ104V

Fitted

1

R57

RES, 0.1 ohm, 1%, 0.1W, 0603

Panasonic

ERJ-3RSFR10V

Fitted

1

SW1

Switch, Tact 6mm SMT, 160gf

Omron Electronics Inc-EMC Div

B3S-1000

PULSE ELECTRONICS

HX1198FNL

Fitted

1

T1

TRANSFORMER, MDL, XFMR SGL ETHR LAN, SOIC-16

Fitted

1

U1

IC, RS485 TRANSCEIVER LP, 8-SOIC

Texas Instruments

SN65HVD72DR

Fitted

1

U2

Stellaris MCU TM4C129XNCZAD 212 BGA

Texas Instruments

TM4C129XNCZAD

Fitted

1

U3

Load Switch, 5.5V, SOT23-5, TPS2051BDBV

Texas Instruments

TPS2051BDBVT

Fitted

1

U4

CAN Transceiver with Fast Loop Times for Highly Loaded Networks, 85 mA, 5 V, -40 to 125 degC, 8pin SOIC (D), Green (RoHS & no Sb/Br)

Texas Instruments

SN65HVD256D

Fitted

1

U5

Regulator, Step Down 3.3V, 0.5A

Texas Instruments

TPS62177DQC

Fitted

1

U6

IC, Current Shunt Monitor, -16V to 80V CommonMode Range

Texas Instruments

INA196AIDBVR

Fitted

1

Y1

Crystal, 25.00MHz 5.0x3.2mm SMT

CTS-Frequency Controls

445I23D25M00000



25

Design Files

8.3

www.ti.com

PCB Layout The complete board is designed in a 2 × 3 inch form-factor PCB. To download the layer plots, see the design files at TIDA-00203.

26

Figure 24. Top Soldermask

Figure 25. Top Overlay

Figure 26. Top Layer

Figure 27. L2 GND Plane




Design Files

www.ti.com

Figure 28. L3 PWR Plane

Figure 29. Bottom Layer

Figure 30. Bottom Soldermask

Figure 31. Bottom Overlay




27

Design Files

8.4

www.ti.com

Altium Project To download the Altium project files, see the design files at TIDA-00203.

Figure 32. Altium Top Layer

28


Figure 33. Altium Bottom Layer



Design Files

www.ti.com

8.5

Gerber Files To download the Gerber files, see the design files at TIDA-00203.

Figure 34. Fabrication Drawing TIDU706A – January 2015 – Revised February 2015 Submit Documentation Feedback


29

Design Files

8.6

30

www.ti.com

Assembly Drawings

Figure 35. Top Paste Assembly

Figure 36. Bottom Paste Assembly

Figure 37. Top Assembly

Figure 38. Bottom Assembly




Design Files

www.ti.com

8.7

Software Files To download the software files, see the design files at TIDA-00203.

9

References 1. Texas Instruments, System Design Guidelines for the TM4C129x Family of Tiva™ C Series Microcontrollers, Application Report (SPMA056). 2. Texas Instruments, Tiva ™ TM4C12 9X Development Board, User's Guide (SPMU360). 3. Texas Instruments, Tiva™ TM4C1292NCZAD Microcontroller, Data Sheet (SPMS444). 4. Texas Instruments, Tiva ™ C Series TM4C1294 Connected LaunchPad Evaluation Kit, User's Guide (SPMU365). 5. Texas Instruments, Introduction to the Controller Area Network (CAN), Application Report (SLOA101). 6. Texas Instruments, Controller Area Network Physical Layer Requirements, Application Report (SLLA270).




31

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