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K&S Thin Die Technology Sematech Symposium Hsinchu October 2012
Thin Die Technology – Agenda Introduction Beneficial Machine Architecture Pick Process & Process Control Application Tools and Optimization Process SW Features for High End Apps Yield Assurance Conclusion / Roadmap
Die & Film Thickness Trends Indexerfor Thin Die Handling Technology: Key Driver
Standard & Multi Needle (Magnetic) Die Ejector Confidential
80
70
60 50 40 Die Thickness [µm]
30
Thin & Small Die (Needle-less) Ejector & Pick Mode 5
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K&S Thin Die Pick Technology - Machine Architecture
Equipment Architecture Moving Bond Vision Fixed Transfer Vision
Key Benefits for Thin Die Handling: Process Performance & Flexibility Optimized pick & place tooling design
Highest Throughput Long pick times for high-end DAF/FOW app‘s are „hidden“ behind bond process through parallel die handling
Indexer Fixed Pick Vision
Process Stability „Cold“ pick process while bonding @ high temperatures Die Ejector
Confidential
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Equipment Architecture = Process Flexibility Pick Tool – Many big holes = Strong pick
Multi-hole tools optimized for pick yield
Separated PTP architecture allows for optimized pick & place processes!
Transfer Tool – High Accuracy
Transfer tool designed for highly accurate handover process Vacuum holes location optimized to prevent “potato chip effect” on thin die for reliable vision Tool has “self cleaning” effect and lowest surface energy – optimized for WBL/FOW handling
Place Tool – No Voids Tool optimized to eliminates voiding
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K&S Thin Die Technology – Pick Process & Process Control
Thin Die Picking Method Piston Ejector 1. Tool Impact Vacuum Level Impact Speed Pick Force
3. Final Peeling Sliding Distance Slide Speed Multi Step configurable
Confidential
4. Die Pick-up Smooth Tool Lift-off configurable
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(Thin) Die Handling Process Control Transfer Force Repeatability at 0.8N Over 1 Hour Production at 4500 UPH
iStack’s Tool Impact, Force & Position Control for Minimum Stress on the Die: Tool impacts at user adjustable constant velocity Tool impacts are automatically detected and adjusted during each machine cycle
0.1 0 -0.1
s = 0.008N, Range = ±0.03N
-0.2 -0.3
Force Control:
0
Force is generated by linear motors (spring-less) with auto calibrated current loops Highest force repeatability through closed loop current control
Deviation from 0.8N
Tool Impact Control:
0.2
Position Control: Dies are positioned and handed over between tools within 1.5µm (sigma), implying zero shear stress during pick and handover Drifts are eliminated through “Dynamic Calibration” during production
K&S Thin Die Technology – Application Tools and Optimization
Thin Die Ejector Optimization Die Ejector Design Optimization using Finite Element Analysis based on:
minimizing tensile (center and neighbor) die stress near/along the die edges
maximizing peel stress along the die edges
Peel Stress FEA – Separation Step
Center Die
Neighbor Die
Die Stress FEA – Separation Step Center Die
Neighbor Die
Confidential
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Thin Die FEA Model Validation Excellent agreement between FEA model and Pick Test (7.8x10.8mm Die, 25µm thin) FEA Model: Red WBL sticks on Tape, Blue WBL peeled from Tape
Ejection Height Low
Ejection Height Medium
Thru-Tape Photos: Dark Grey WBL sticks on Tape, Light Grey WBL peeled from Tape Confidential
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Ejection Height High
Thin Die FEA Model Validation
Die Thickness DAF Tape Die Sizes
100.00%
1800
99.00%
1600
98.00%
1400
97.00%
Yield
Pick Cycle time
15µm Hitachi FH9011 17.15mm x 9.70mm 16.90mm x 10.65mm 10.80mm x 7.80mm 350ms
1200
96.00% 1000 95.00% 94.00% 93.00%
"no crack" yield
800
pick yield
bonded units
600
92.00%
400
91.00%
200
90.00%
0 Piston 2011
ejector type Piston 2011 Piston 2012 Slider
Confidential
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Units Bonded
Process Tests on Various Devices for Verification of FEA Results & Developments Test Device Information: Thin Die Picking Performance on 15µm Die
die picked 224 231 1684
Piston 2012
crack yield 100.00% 100.00% 100.00%
Slider
pick yield 99.55% 100.00% 100.00%
total yield 99.55% 100.00% 100.00%
K&S Thin Die Pick Tools Seal Lip Pick Tool maintains vacuum between tool and thin die if the die deforms:
Strengthens grip and adds stiffness to the die Increases pick-up yield Avoids stress due to pressure difference between atmospheric pressure and ejector vacuum Reduces die bending
Standard Pick Tool
Seal Lip Pick Tool
FEA of tool with vacuum, showing lip seal compliance
Flexible seal to cover the edges of die
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Thin Die Technology – SW Features for High-End App’s
SW Features for High-End App’s Multi-Step Separation Process:
More flexibility to parametrize the separation process
Better control of initial peel process for applications with high “edge tackiness” (Fast) Initial peel process for low “edge tackiness”:
Configuration of Multi-Step Separation
Dt = 2ms
Pick Tool / Piston Position [µm]
Die in front
Pick tool
(Slow) Initial peel process for high “edge tackiness”: 250 200 150
Dt = 40ms
100 50
Dt = 60ms
0 0
100
200
300
400
500
600
700
Time [ms] Separation @ 1% Speed
Confidential
800
Dt = 70ms
With Multi-Step Separation
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SW Features for High-End App’s Smooth Pick Tool Lift-off @ End of Pick Process:
More flexibility to parametrize the pick tool lift-off motion
Higher process reliability for extremely thin or high “edge tackiness” dies
Configuration of Smooth Lift-off
1
Pick tool
2
3
Die lost from tool
4
Pick Tool Position [µm]
100 80 60 40 20 0 0
50
100
150
200
250
300
350
400
Time [ms] Slow Setting
Confidential
Medium Setting
Fast Setting
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SW Features for High-End App’s K&S Mixed Signal Scope for Process Setup:
K&S includes unique monitoring and diagnostics SW scope, tracking all
axes position, speed & acceleration set points & actual readings, digital and analogue I/O’s
Allows for detailed pick process analysis & optimization
Example: Pick tool detects leaks between pick tool and die Conclusions on effectiveness of peel process Pick Tool Flow Sensor & Vacuum Supply
Ejector Vacuum Supply
Initial peeling not started – leakage between tool and die during separation Confidential
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Pick Tool Flow Sensor & Vacuum Supply
Ejector Vacuum Supply
Initial peeling completed – no leakage between pick tool and die
Thin Die Technology – Yield Assurance
Yield Assurance Crack Inspection System Transfer Camera:
Hi-Resolution Microscope:
K&S technique:
Full Die image @ 30µm/pix Technically NOT possible to
0.6µm/pixel very small FOV Hard to tell Edge from Cracks Needs multi-image scanning
Full Die image at 60µm/pixel resolution Special illumination technique High resolution NOT required even for 1µm crack
make Cracks visible with full field FOV sensor (MP limit)
(time consuming = low UPH) Cracks appear as bright signals on dark background
Red Lines indicate Cracks 10.0mm Confidential
320µm
17.1mm
1.7 / 4.4µm crack width
SEM image 10mm
210µm 23
“Crack Detection Module” Inspection after Die Pick-Up
Thin Die Technology – Conclusion / Roadmap
Conclusion / Roadmap Conclusion
Production proven ‘Best in Class’ Thin Die Handling
Demonstrated Unique Crack Detection Capability
Roadmap - Extension of Current Thin Die Technology to Advanced Packages
Background
TSVs will create different stress distribution in thin die.
Thinner Die easier Via manufacturability smaller possible Via (aspect ratio Via depth/)
Pillars are not touchable. Changed Pickup Tool geometry different stress distribution.
We will enhance existing technology for thinnest possible TSV / Copper Pillar Die.
Verification on suitability of existing thin die technology is started
Reduce inner stress on TSV and Copper Pillar Dice with FEA models and validation.
Looking for partners to validate Technology on TSV and Copper Pillar Dice in production environment.
Confidential
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Question
/
Answers
Company Copyright
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