Sensors & Technologies for The Internet of Things

Technologies & Sensors for the Internet of Things Businesses & Market Trends 2014 - 2024

The Internet of Things (IoT) provides big opportunities for technologies. The device business will reach $45B in 2024, contributing to a total IoT market of $400B.

© 2014

Table of Contents • •

Executive Summary……………………………….…….. 7 • Introduction…………………………………………..…. 29 – – – – – –

•

Seven Generations of IoT Sensors to appear…....... 55 – – – – – – – –

•

Internet of Things Promises Definition Report Scope Sensors for IoT Applications Structure of IoT IoT Map Device

• Industrial sensors – Description & Characteristics First Generation – Description & Characteristics Advanced Generation – Description & Characteristics Integrated IoT Sensors – Description & Characteristics Polytronics Systems – Description & Characteristics Sensors' Swarm – Description & Characteristics Printed Electronics – Description & Characteristics • IoT Generation Roadmap

Market Forecasts 2014 - 2024………………...……..... 84 – – – – – –

© 2014•

Market Structure Value (in $M) Market Value by Application Domain (in $M) Volume Forecasts (Munits) Cost Breakdown per Module (in $M) Market Value per Generation (in $M) Market Volume per Generation (Munits)

•

IoT Characteristics, Challenges & Roadmap......… 104 – – – – – – – –

IoT Development Examples………………..……...… 136 – – – – –

ACOEM Eagle EnOcean Push Button NEST Sensor Ninja Blocks And more…

Focus on Wearable Electronics…………….…….… 167 Technological Analysis……………………….……… 184 – – – – –

•

Adapted Price Systems Form Factor Low Power Consumption Protocols & Standards Privacy & Security Market Traction Reliability & Lifespan Data to Process

Wireless Sensor Structure Energy Storage Module Power Management Module RF Module Sensing Module

Conclusion……………………………………………… 273

2 Yole Développement Copyrights 2014 – MEMS Report

About the Authors Dr. Guillaume Girardin Dr. Guillaume Girardin works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Guillaume holds a Ph.D. In Physics and Nanotechnology from Claude Bernard University Lyon I and a M.Sc. in Technology and Innovation Management from EM Lyon - School of Business. Contact: [email protected]

Antoine Bonnabel Antoine Bonnabel works as a Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Antoine holds a M.Sc. In Microelectronics and Microsystems from Grenoble Institute of Technologies and a M.Sc. In Marketing and Business Management from Grenoble Graduate School of Business. Contact: [email protected]

Dr. Eric Mounier Dr. Eric Mounier co-founded Yole Développement in 1998. He oversees technology analysis for MEMS-related manufacturing technologies and Optical MEMS (including micromirrors, micro-displays, autofocus and IR micro-bolometers) applications within the company. Eric has also developed a unique cost modeling tool, called “MEMSCoSim”, which is able to evaluate the cost of MEMS module manufacturing. Contact: [email protected] © 2014•


Companies Listed in this Report

ACOEM, AdvanticSys, Amazon, Apple, AT&T, Atmel, Ayla Networks, AVAGO Technologies, Blackberry, BOSCH, BLUECHIIP, Cambridge CMOS Sensors, CEA Liten, China Mobile, Cisco, DataVeyes, DG Logik, DISCERA, Enfucell, EnOcean, EPCOS, FitBit, Flutura, Fraunhofer Institute, FREESCALE Semiconductor, GE, Georgia Institute of Technology, Google, HEWLETT PACKARD, Hillcrest Labs, HITACHI, Honeywell, HTC, IBM, Infomotion Sports Technologies, ioBridge, INTEL, Intellisense.io, InterSoft, INVENSENSE, Jabra, Jasper Wireless, Jawbone, Kionix, Kistler, KNOWLES Electronics, Koubachi, KTH, KwikSet, KWJ Engineering, Lenovo, Lightning Switch, Lime Microsystems, LogBar Inc., LumoBack, M2M Cyber Security, M2Mi, MC10 Inc., Marlow Industries, MEMSIC, Micropelt, Misfit, MURATA, MYO, Navisens, Nest, Netatmo, Newco, Nike, Nintendo, Nokia, NXP Semiconductors, OnFarm Systems, Optoi MicroElectronics, Oracle, Pebble, Purdue University, Rosemount, Samsung, SemTech, Sensaris, Sensata, Sensirion, Sensonor, SensorSuite, Sharp, Si Time, SiLabs, SmartThings, Sony, STMicroelectronics, Synkera Technologies, TeledyneDALSA, Texas Instruments, ThinFilm Electronics, TriQuint, Tronics MicroSystems, TSMC, Variable Technologies, UCLA, University of Harvard, VitalConnect, VTT MEMS, WiSpry, Withings, X-Fab MEMS Foundry, Xymox technologies Inc.

© 2014•


Key Features •

The objectives of this report is to provide:

– Understanding of IoT value chain structure (device, data cloud), application areas and technologies involved

– Technology trends and evolution of IoT device in the coming years

– Market forecast for IoT devices in Munits and $M for 2014 – 2024, with a focus on sensors

– IoT applications and examples overview (building automation, transportation, healthcare, industry, etc.) with a focus on wearable electronics

– The technological challenges faced by IoT devices, with a focus on wireless, energy, power, RF and sensing modules

© 2014•


Who Should Be Interested in this Report ? •

R&D, Components Manufacturers Companies – – –

•

OEMs & Integrator Companies – –

•

To evaluate benefits of integrating sensors in IoT devices Get the list of key players and emerging start-ups in this industry

Cloud & Telecommunications Companies – – –

•

Evaluate market potential of future IoT technologies and products for new applicative markets Spot new opportunities and define diversification strategies Position your company in the ever changing IoT market structure

Understand the evolution of IoT devices and the market structure Understand the differentiated value of products and services in this market Identify new business opportunities and prospects

Financial & Strategic Investors – –

© 2014•

Understand the potential of incoming Internet of Things revolution Get the list of key players and emerging start-ups in this industry


Report Scope •

Yole’s definition of the Internet of Things is as follows: –

Internet of Things devices is the aggregation of all the sensing modules that are linked to the Cloud – either directly or through a gateway – and which data is processed and valorized in any manner (through selling to a third party, through monitoring of a piece of equipment, etc.).

•

This report looks at the Internet of Things market in general, but with a strong focus on sensing modules. We do not detail the cloud computing industry nor the data processing services.

•

We do not include in our valorizations the benefit brought by IoT solutions through productivity gains. The values estimated are from hardware, cloud computing processing services and data processing services charging.

© 2014•


IoT Global Market Structure (1/3) Information Flux Statistics

Connected Devices

Targeted Ads

Hardware

Data Service Companies

Third Party

Wireless Sensor Module

IoT Market structure


Cloud

HUB / Gateway

© 2014•

8

Cloud Companies

Information Flux Yole Développement Copyrights 2014 – MEMS Report


Area Of Application

Transportation

Building Automation Healthcare & Life Science Retail& Logistics

Security & Public Safety

Industrial Consumer & Home automation

© 2014•

Environment


Summary of Technologies of IoT Markets and Sensors • Here are the main applications of IoT devices and sensors associated with.

Legend:

Sensor

Level of demand

Building Automation

INTERNET

Healthcare & Life science

OF

OF

THE

SENSORS

THINGS

Transportation

Consumer & Home automation

Pressure

Bio Sensors

Gyroscope

Temperature

Gyroscope

Pressure

Temperature

Temperature

Inertial

Accelero

Chemical

Accelero

Temperature

Chemical (CO2)

Chemical

Magneto

Magneto

Accelero

Light

Pressure

Chemical

Light

(IR, visible)

Contact

(IR, X-Ray)

Industrial

Environment

Pressure

Hall Effect

Chemical

Light

Accelero

Temperature

Accelero

Pressure

Chemical

Light

Magneto

Temperature

Temperature

Pressure

Chemical

Chemical

(IR,Optical)

© 2014•

Humidity

Retail & Logistics


(IR, visible)

Gyro


Light (IR,XRay,THz)

Light

(IR/Optical)

Magneto

IoT Wireless Sensors Map POWER MANAGEMENT MODULE

• •

Ultra-capacitors Microbatteries

•

PMU

ENERGY STORAGE MODULE

• •

Li-Ion battery AAA/AA Batteries

•

Energy Harvesting

SENSING MODULE

• • • • • • •

RF MODULE

• • • •

Signal Processing • Unit • Wifi • ZigBee Bluetooth LE

© 2014•

Radio Transceiver Duplexer BAW


Accelerometers Magnetometers Gyroscopes Acoustic Sensors Pressure Sensors Humidity Sensors Temperature Sensors

• • • • •

Proximity Sensors Image Sensors Light Sensors Gas RFID Sensors Micro Flow Sensors

Solution Price IoT Roadmap Solution Price per sensor module Rosemount 3051C Smart Pressure Transmitter Source: Rosemount

$2000

NEST Smart Thermostat (current price: $250) Source: NEST

$250 Fitness Activity Tracker (current price: $130) Source: Jawbone

$50

Multiple temperature sensors for home automation (current price: $75) Source: EnOcean

MEMS-based chemical sensing Source: Optoi Microelectronics

$5

Sensors' swarm - Michigan Micro-Mote Source: University of Michigan

$1

Batch-level RFID Temperature Sensor Tags (current price: $ range) Source: ThinFilm Electronics

$0.5 $0.05

Item-level RFID sensor tags

Today © 2014•

2016

2018

2020


2024

2024+

Summary of Technologies of IoT Forecast : Hardware Market Value by Application Domain Market Value by Domains of Applications ($M) 70,000

2018

$70B 60,000

Cloud

Market Value ($M)

50,000

40,000

30,000

20,000

10,000

-

2014

2015

2016

2017

2018

2019

2020

2021

2022

2023

2024

CAGR

9,458

17,895

34,426

58,295

69,995

67,200

54,555

54,785

47,005

43,172

46,338

42%

Environment

-

-

15

50

80

175

280

300

400

700

1,290

124%


-

-

-

-

60

100

45

225

525

1,050

1,785

113%

Total Value Market ($M)

Retail & Logistics Industrial Healthcare & Life Science Consumer & Home Automation Building Automation Automotive

© 2014•

-

-

38

188

368

1,025

1,203

3,100

3,000

5,400

6,210

139%

3,420

4,320

5,580

6,885

11,226

10,725

9,150

9,135

8,290

7,632

7,983

32%

-

-

19

113

346

773

1,338

2,455

3,420

4,620

6,330

165%

5,938

13,125

27,575

48,075

52,975

45,045

31,390

26,870

20,720

13,920

12,560

29%

100

450

1,200

2,985

4,940

9,335

11,060

12,250

9,300

7,600

7,270

80%

-

-

-

-

-

23

90

450

1,350

2,250

2,910

140%


Wearable Electronic Market •

The global wearable electronics market can be segmented in 5 categories. Head-Wear category includes helmet product and vision aid. There’s also a category of products for neck-wear, with collars and necklace products that cover up electronics with jewels. Arm-Wear category is the most burgeoning category with multiples devices expected wristband, smart watches, ring, armband, etc. Body-Wear products include smart clothing, and devices monitoring back/spine position. And the last category concerns foot-wear.

Wearable Electronic Market Segmentation:

Head-Wear

Neck-Wear

Arm-Wear

Body-Wear

Foot-Wear

Helmet

Jewelry

Smart watches

Clothing

Shoes

Smart Glasses

Collars

Wristband

Back/Spine

Socks

Ring

Google Glass

Shine

Myo Ring

LumoBack Smart Watch © 2014•


Arm-Wear market is one of the most promising market and many actors are targeting it.

Wearable Electronic A new opportunity for sensor fusion / processing

•

Wearable electronics is a new big opportunity for sensors – –

Fitness / activity monitoring, healthcare, sports applications In many cases the sensor acts as a hub • •

–

Basic calculations can be done at the device level After transmission (enabled by low energy Bluetooth) : advanced software / fusion can be done by the smartphone

Bellow are many examples of such developments:

I’m watch (2012) •

Integrates accelerometer + magnetometer

Moto 360 by Motorola (End 2014) •

Other connected watches are currently in development by major OEMs (LG G Watch, rumors about Apple iWatch…)

© 2014•


Pebble Watch (0,4 MUnits sold in 2013)  Features STMicroelectronics accelerometer

Wearable Electronic / Connected Devices Examples of new devices (2/4)

MYO by ThalmicLabs • • -

Proprietary EMG muscle activity sensors Nine-axis IMU containing: three-axis gyroscope three-axis accelerometer three-axis magnetometer

BodyMedia (Acquired by Jawbone in 2013) •

Integrates MEMS accelerometer (from Kionix and STMicroelectronics) in its systems for fitness application

•

We note that no gyroscopes are used presently. This would enable more precise monitoring and

Cell Phone as a Hub

new sport applications, however power consumption would be too high. It could be part of larger systems in the future.

NodeKore from Variable Technologies Jawbone Up24 © 2014•


Available MEMS Reports Uncooled Infrared Imaging Techology & Market Trends

New! MEMS Pressure Sensor

New! Status of the CMOS Image Sensors

Emerging MEMS

Status of the MEMS Industry

New!

New!

MEMS Front-End Manufacturing Trends

New! Technology Trends for Inertials MEMS

Sensor fusion of acceleros, gyros & magnetometers

© 2014•

MEMS for Cell Phones and Tablets

Inertial MEMS Manufacturing Trends 2014

New! RF Filters, PAs, Antenna Switches & Tunability for Cellular Handsets

Infrared Detectors Technology & Market Trends

New! IMU & Gyro for Defense, Aerospace & Industrial

New! Ferro-Electric Ferro-Electric Thin Thin Films Films

Thin Wafer Handling


Trends in MEMS Manufacturing & Packaging

MEMS Cosim+ MEMS Manufacturing Cost Simulation Tool

Motion Sensors for Consumer & Mobile applications

Yole activities in MEMS MEDIA

REPORTS

CONSULTING

News portal/Technology magazines/ Webcasts/Communication services

Market & technology/Patent Investigation/Reverse costing

Market research/Technology & Strategy/Patent Investigation/ Reverse costing

www.yole.fr

Status of the MEMS Industry

YOLE FINANCE M&A/ Due Diligence/ Fundraising/ Technology brokerage

www.yolefinance.com

PARTNERS

© 2014•


Our Offices & Contact Information Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: [email protected] • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr European and North America Office • Jean-Christophe Eloy, Email : [email protected] •

Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: [email protected]

Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email: [email protected]

© 2014•


For More Information… Take a look at our websites

www.yole.fr Yole Développement corporate website

www.i-micronews.com News Portal - online free registration to our publications

www.systemplus.fr Sister company expert in teardown & reverse costing analysis

www.yolefinance.com Separate business unit of Yole dedicated to financial services

Follow us on

© 2014•


Market & Technology Report

Internet of Things

Technologies & Sensors for the Internet of Things: Businesses & Market Trends 2014-2024 The Internet of Things (IoT) provides big opportunities for technologies. The device business will reach $46B in 2024, contributing to a total IoT market of $400B. REPORT OUTLINE • Title: Technologies & Sensors for the Internet of Things • June 2014 • Market & Technology Report • PDF file • €5,990 - Multi user license (270+ slides) • €3,990 - One user license (270+ slides) KEY FEATURES OF THE REPORT • Understanding of IoT value chain structure (device, cloud, data), application areas and technologies involved. • Technology trends and evolution of IoT devices in the coming years. • Market forecasts for IoT devices in Munits and $M for 2014-2024, with a focus on sensors. • IoT applications and examples overview (building automation, transportation, healthcare, industry, etc.) with a focus on wearable electronics. • The technological challenges faced by IoT devices, with a focus on wireless, energy, power, RF and sensing modules. RELATED REPORTS • Silicon Photonics Market & Technologies • Emerging MEMS • MEMS & Sensors for Mobile Phones and Tablets • EnOcean PTM210 Self-Powered Push Button Transmitter Module

FROM $9.5B IN 2014 TO $46B IN 2024, THE IOT DEVICE MARKET WILL REPRESENT CLOSE TO 15% OF ALL DATA PROCESSING IoT devices offer huge potential for electronic

Some companies have already started positioning

component manufacturers, but this is clearly not

themselves in these fields: for example, Oracle

where the value will stop. Most of the added value

and Amazon are developing their cloud computing

in IoT solutions will come from the processing of

capabilities;

the generated data. In fact, the ratio between electronic components and data processing can reach 1:50 in certain long-term cases! This is easily understandable, since the main purpose of the IoT is to make sensing ubiquitous at a very

and

teams dedicated to the IoT; and Google and Facebook

are

continuously

developing

their

data processing models while looking to acquire companies linked to data gathering. Of course, not

pressure on electronic component manufacturers.

The short-term opportunity lies in the electronics

Nevertheless, the next five years will be extremely

industry. Indeed, very strong price pressure is

fruitful for device makers; the market should reach

expected for IoT devices, and strong volumes

$70B by 2018, before decreasing. This period

are expected but at very low cost. Even though

represents a key window in which manufacturers

the general electronics market will experience

must seize the opportunity to grab a piece of the

strong growth, it will be through decreased costs,

IoT business pie.

increased manufacturing capabilities and reduced

The IoT is a multi-billion dollar market emerging from several different markets (i.e. industrial sensors,

wearable

electronics

and

home

automation) which will see strong convergence in the next five years. Three industrial and service sectors will be integral to the valorization of this new market:

• The

electronics

industry,

which

will

manufacture the sensing devices

• The communication and cloud data storage

industry, which will handle data transmission, storage and processing

margins. This trend has already been seen in the MEMS field over the past few years, and will repeat itself in the future. The same is to be expected for the cloud computing industry. Large investments in terms of data storage will be needed, but strong price pressure is expected, and an overall low value will be attributed to the physical data. Actually, the war on price has already begun between the major cloud computing companies, which are cutting data storage prices while growing their capabilities. Meanwhile, on the data processing side, more and more information will be available, and at low cost.

• Service companies, which will valorize the

The more data, the higher the value, and all of this

data either through processing or by selling

with low overall infrastructural investment. Service

to a third party

companies will be the big winners in this field. In

Repartition of value in market structure 300

200

$400B $400B 100

Cloud

Cloud

0

0

Devices

all of them will be winners.

Market value ($B)

Market value ($B)

100

Connected

low cost, resulting in extremely strong price

300 Find all our reports on www.i-micronews.com

200

Bosch

Solutions GmbH and STMicroelectronics have

2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 CAGR

2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 CAGR

(Yole Développement, June 2014)

Technologies & Sensors for the Internet of Things 2024, with $46B coming from hardware, $59B from

companies will have no choice but to try and integrate

the cloud and $296B from data processing.

themselves vertically in order to valorize themselves

This report provides a detailed analysis of applications,

and the data they’ll be responsible for! As an example,

business models and technical challenges in order to

we expect the overall IoT market to reach $400B in

understand the IoT market’s potential.

THE INTERNET OF THINGS’ TECHNOLOGICAL EVOLUTION: IT’S ALL ABOUT HETEROGENEOUS INTEGRATION AT DEVICE AND MODULE LEVELS The array of technologies available – and soon to be

The Internet of Things roadmap

available – is immense. Nevertheless, the evolution of sensing modules for the IoT will follow a predefined

IoT sensing modules mandatory characteristics RF transmission protocol

Other main challenges

trend that can be summarized in a series of seven

Other main challenges

product generations, including large industrial smart

Annual Market Volumes per Specific Application

$0.05

sensors, an advanced generation of sensors, and

1 000 000 000 Printed Electronics

IEEE 802.15.4 based IPv6 protocols (6LoWPAN) Standardized low power protocols

(ZigBee,WirelessHART, Bluetooth LE)

Standardized common protocol (Bluetooth, Wi-Fi)

$5

Security and privacy of data

$50

Clear definition of the market tractions

Integrated IoT sensors

10 000 000

Advanced Generation of IoT Sensors

modules dedicated to IoT application. These devices represent the integration of off-the-shelf electronic

100 000

Large Industrial Smart Sensors

components in a single package in order to offer new functionality. Not much effort has yet been given to

10 000

Today

2016

2018

2020

2022

• One of these generations, already being seen

today, is actually the first generation of sensing

1 000 000

First generation of IoT sensors

$2000

described below:

50 000 000

Sensors‘ swarm

$250

Proprietary industrial protocols

Développement’s report, but a few examples are

Polytronics Systems

$0.5

Very low power electronics and sensors multiplicity

polytronics. These generations are detailed in Yole 100 000 000

$0.25

Polytronics & Printed electronics maturation

integration, as the main focus has been on bringing

2024

a new function to market. Today, examples of such

(Yole Développement, June 2014)

devices are numerous; some, such as the Nest (now Google) smart thermostat, find market interest and success - while others, i.e. “smart forks”, “smart sprinklers” and other “smart” devices, don’t. Other devices are addressing domains such as wearable electronics and home & building automation. For these devices, we expect a market volume of 200M units by 2017, representing a market potential of $83B.

• One example of a future sensing generation is integrated sensors, which are expected for 2020 and

which will be the one to democratize IoT. Its general description is “the integration of IoT-dedicated electronic components” – meaning very small, very low-cost, very low-power consumption components like MEMS-based sensors. The essence of such devices is to be low cost and thus ideal for high-volume applications, with lowpower wireless protocols, ultra-low power electronics. One example of such a device is the integration of a hazardous chemicals sensor in an industrial worker’s gear. Another example is the integration of connected condition-monitoring sensors in a car engine. We expect a market volume of 2B units for these devices by 2021, representing a market potential of $107B. This report provides a detailed analysis of these generations and the technical and market challenges they must overcome before reaching the market. Yole Développement’s analysis shows how these challenges can be defeated in order to strengthen market growth.

FROM HARDWARE TO CLOUD TO DATA PROCESSING: WHERE WILL THE IOT’S VALUE FLOW? Hardware Market Value in IoT Structure ($M)

Data Market Value in IoT Structure ($M)

200 000

2014

150 000

50 000 0

2015

2016

2017

2019

2020

2021

2022

2023

2024

100 000

CAGR

Data Processing

200 000

Data Valorization

150 000

2015

2016

2017

2018

2019

2020

2021

2022

2023

2024


CAGR

3000000 2014

2015

2016

2017

2018

2019

2020

2021

2022

Cloud Valorization

70 000 20 000

50 000 40 000 30 000

0

Integr

ator

2018

2019

2020

2021

2022

2023

2024

Hardware Hardware

70 000 Hardware Market Value in IoT Structure ($M) 60 000

70 000

60 000 2015 2014

2016

50 000

50 000 40 000

2017

2018

2019

2020

2021

2022

2023

2024

20 000

0

2014

20 000

2014

2015

2015

2016

2016 2017 10 000

0

ator

2017

2018

2019

2020

2021

2022

2018

2019

10 000

150 000

0

2020

2014

2021

2015

2022

2023

2016

2024

2017

CAGR

2018

2019

2020

2023

Data

Valorization 2021 2022 2023

2015

2016

2017

2018

2019

2020

2021

2022

2023

Cloud Market Value in IoT Structure ($M)

2024

Data Valorization

Integr 50 at 000 or

Data IoTStructure ($M) Cloud Market Value in IoT Market Valorization structure

2015

2016

2017

2018

2019

2020

2021

2022

2023

Integ

2024

CAGR

rator

40 000 30 000 20 000

2014

2015

2016

2017

2018

2019

2020

2021

2022

2016

2017

2018

2019

2020

2021

2022

2023

Hardware

2024

CAGR

For Yole Développement, the IoT is defined as the

30 000

50 000 40 000 30 000

aggregation of all the sensing modules which are

IoT 20 000 MarketCAGR 2024 structure

20 000

Integr

10 000

ator

2014

2015

0

2016

2017

2014

2018

2015

2016

2019

2017

2018

2020

2019

2021

2020

2021

2022

2022

2023

2023

2024

2024

CAGR

CAGR

gateway – and with which data is processed and


Integr

ator

monitoring a piece of equipment, etc.). We

focused

characteristics

10 000 0

Hardware Market Value in IoT Structure ($M)

2015

valorized in any manner (selling to a third party,

40 000

600000 2014 50 000

30 000

linked to the Cloud – either directly or through a

60 000

20 000

40 000

0

CAGR

70 000

30 000

40 000

20 000 80 000 10 000 70 000 0 60 0002014

50 000

10 000

2014

50 000

belong to numerous domains.

60 000 CAGR

2024

60 000

2023

2024

CAGR

on

the

analysis

of

of

IoT

devices

such

technical as

the

nature of the electronic components to use, the corresponding RF protocols, device power

30 000

consumption,

10 000

2017

2018

2018

2019

2019

2020

2020

2021

2021

2022

2022

2023

2024

2023

CAGR

2024

2014 2015 2016 June 2017 2014) 2018 2019 (Yole Développement,

Integr

CAGR

40 000

30 000

30 000

70 000 10 000

CAGR


10 000 0

2017

80 000

Market value ($M)

60 000

2016


30 000 20 000 80 000 10 000 70 000

Market value ($M)

Market value ($M) Market value ($M)

40 000

20 000


Market structure

Cloud

60 000 10 000

ud

CAGR IoT


2015

2017

200 000

Market value ($M)

Market value ($M)

Data 2024 2023

Market value ($M)

2014

40 000

2014

2016

20 000

0

50 000

50 000 0

2016

50 000

60 000

30 000

2015

40 000

250 000

Cloud Market Value in IoT Structure ($M) 0

0 50 000 2014

Integr100 000 ator

50 000

70 000

2015

Hardware encompassing a wide variety of applications that

70 000

10 000 60 000


50350 000000

250 000

100 000

2014

2018

150 000

Hardware

80 000

20 000 70 000

200 000

Hardware

70 000

Market value ($M)

300 000

Market value ($M)

250 000 0

30 000 80 000

250 000

80 000

in IoT Structure ($M) a generic concept cloud Hardware and Market dataValueprocessing;


Market value ($M)

350 000

300 000 50 000

40 000

Market value ($M)


350 000 100 000

300 000 Market value ($M)

Data Data Market Value in IoT Structure ($M)Processing

150 000

Market value ($M)

Market value ($M)

350 000

100 000

d


50 000


200 000

Market value ($M)

cessing

The Internet of Things is a mix of hardware,

60 000

General IoT market structure & forecast

250 000

Market value ($M)

Market value ($M)

70 000

300 000

ssing

Hardware

80 000

350 000

sing

n

order to secure some of this value, hardware and cloud

2020

etc.;

as

well

as

economic

characteristics, especially regarding the IoT’s

CAGR

2021

2022

2023

2024

CAGR

value, and where market potential lies.

Market & Technology Report Our roadmap is based on analysis of:

• Current state-of-the-art electronics, and the large number of technologies in development.

• The current technological evolution of wireless transmission regarding protocols & standards.

• The recent discussions and actions pertaining to consumer privacy and data security.

• Sensor multiplicity and integrated sensor developments.

• Additional topics such as solutions costs, and where market traction comes from.

Also, it’s still unclear which technological platform will be used, which data transmission protocols will be chosen, and which business model will be proven. Many applications are striving for the blue ribbon, but only the proven ones will drive volume. This report analyzes the strong challenges awaited regarding the identification of those applications which are expected to provide market volume, and those which are bound to fail.

OBJECTIVES OF THE REPORT This report aims to provide: • An understanding of the IoT value chain structure (device, cloud, data), application areas and technologies involved • The future evolutionary trend of IoT device technology • A market forecast for IoT devices in Munits and $M for 2014-2024 • IoT applications & examples overview (building automation, transportation, healthcare, industrial...) • The technological challenges facing IoT devices

AUTHORS Dr. Eric Mounier has a PhD in microelectronics from the INPg in grenoble. he previously worked at CEA LETI R&D lab in grenoble, France in marketing dept. Since 1998 he is a co-founder of Yole Developpement, a market research company based in France. At Yole Developpement, Dr. Eric Mounier is in charge of market analysis for MEMS, equipment & material. he is Chief Editor of Micronews, and MEMS’Trends magazines (Magazine on MEMS Technologies & Markets).

COMPANIES CITED IN THE REPORT (non-exhaustive list) ACOEM, AdvanticSys, Amazon, Apple, AT&T, Atmel, Ayla Networks, AVAGO Technologies, BOSCH, BLUECHIIP, Cambridge CMOS Sensors, CEA Liten, China Mobile, Cisco, DataVeyes, DG Logik, DISCERA, Enfucell, EnOcean, EPCOS, FitBit, Flutura, Fraunhofer Institute, FREESCALE Semiconductor, GE, Georgia Institute of Technology, Google, HEWLETT PACKARD, Hillcrest Labs, HITACHI, Honeywell, HTC, IBM, Infomotion Sports Technologies, ioBridge, INTEL, Intellisense.io, InterSoft, INVENSENSE, Jabra, Jasper Wireless, Jawbone, Kionix, Kistler, KNOWLES Electronics, Koubachi, KTH, KwikSet, KWJ Engineering, Lenovo, Lightning Switch, Lime Microsystems, LogBar Inc., LumoBack, M2M Cyber Security, M2Mi, MC10 Inc., Marlow Industries, MEMSIC, Micropelt, Misfit, Motorola, MURATA, MYO, Navisens, Nest, Netatmo, Newco, Nike, Nintendo, Nokia, NXP Semiconductors, OnFarm Systems, Optoi MicroElectronics, Oracle, Pebble, Purdue University, Rosemount, Samsung, SemTech, Sensaris, Sensata, Sensirion, Sensonor...

TABLE OF CONTENTS

• Executive summary • Introduction

> > > > >

7 29

Definition Report scope Sensors for IoT applications Structure of IoT IoT map device

Seven generations of IoT sensors to appear 55 > Description & characteristics of: Industrial sensors – first generation – advanced generation – integrated IoT sensors – polytronics systems – sensors swarm – printed electronics > IoT Generation Roadmap Market forecasts 2014-2024

84

> Market structure value (in $M) > Market value by application domain (in $M) > Volume vorecasts (Munits) > Cost breakdown per module (in $M) > Market value per generation (in $M) > Market volume per generation (Munits)

Antoine Bonnabel, works as market & Technology analyst for MEMS devices and technologies at Yole Développement. He holds a M.Sc. in microelectronics and microsystems from Grenoble Institute of Technologies and a M.Sc in marketing and business management from Grenoble Graduate School of Business.

IoT characteristics, challenges & roadmap 104

> > > > > > > >

Adapted price systems Form factor Low power consumption Protocols & standards Privacy & security Market traction Reliability & lifespan Data to process

IoT development examples

> > > > >

136

ACOEM eagle EnOcean push button NEST sensor Ninja blocks And more…

Focus on wearable electronics

167

Technological analysis

184

> > > > >

Wireless sensor structure Energy storage module Power management module RF module Sensing module

Conclusion

273

Dr. Guillaume Girardin works as Market & Technology Analyst for MEMS devices and technologies at Yole Développement. Guillaume holds a Ph.D. in Physics and Nanotechnology from Claude Bernard University Lyon I and a M.Sc. in Technology and Innovation Management from EM Lyon - School of Business.

ORDER FORM Technologies & Sensors for the Internet of Things BILL TO

PAYMENT BY CREDIT CARD Visa

Name (Mr/Ms/Dr/Pr): Job Title:

Mastercard

Amex

Name of the Card Holder:

Company:

Credit Card Number:

Address:

City:

Card Verification Value (3 digits except AMEX: 4 digits):

State:

Expiration date:

Postcode/Zip:

/

BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code : 00170 Account No: 0170 200 1565 87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587

Country*: *VAT ID Number for EU members:

Tel: Email: Date:

PRODUCT ORDER Please enter my order for above named report : One user license*: Euro 3,990 Multi user license: Euro 5,990 For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1)

Signature:

RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America: David Jourdan - [email protected] • Asia: Takashi Onozawa - [email protected] • Europe & RoW: Jean-Christophe Eloy - [email protected] • Korea: Hailey Yang - [email protected] • General: [email protected] (1)

*One user license means only one person at the company can use the report. Please be aware that our publication will be watermarked on each page with the name of the recipient and of the organization (the name mentioned on the PO). This watermark will also mention that the report sharing is not allowed.

O ur Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: June 2nd, 2014

SHIPPING CONTACT First Name:

Last Name:

Email:

Phone:

ABOUT YOLE DEVELOPPEMENT Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CONSULTING • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis More information on www.yole.fr

FINANCIAL SERVICES • Mergers & Acquisitions • Due diligence • Fundraising • Coaching of emerging companies • IP portfolio management & optimization More information on www.yolefinance.com

MEDIA & EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics • Communication & webcasts services • Events: Yole Seminars, Market Briefings… More information on www.i-micronews.com

REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation More information on www.i-micronews.com/reports

CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy ([email protected]) • Financial Services: Géraldine Andrieux-Gustin ([email protected]) • Report Business: David Jourdan ([email protected]) • Corporate Communication: Sandrine Leroy ([email protected])

TERMS AND CONDITIONS OF SALES Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: • One user license: one person at the company can use the report. • Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included. • Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included. “Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files. “Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends. 1. SCOPE 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer. 1.3 O rders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. MAILING OF THE PRODUCTS 2.1 P roducts are sent by email to the Buyer: • within [1] month from the order for Products already released; or • within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress. 2.2 S ome weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products. 2.3 T he mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3. 2.4. T he mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.

2.5 T he person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. . 2.6 N o return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk. 3. PRICE, INVOICING AND PAYMENT 3.1 P rices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order. 3.2 Y ole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%. 3.3 P ayments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87 BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587 To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 P ayment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment. 3.5 I n the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages. 4. LIABILITIES 4.1 T he Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof. 4.2 T he Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement 4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof. 4.4 A ll the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 A ll the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 I n the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 T he deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages.

4.8 T he Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. PROTECTION OF THE SELLER’S IPR 6.1 A ll the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 T he Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including any local area network); • Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; • Posting any Product to any other online service (including bulletin boards or the Internet); • Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 T he Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 T he Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 I n the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 I n the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the nonbreaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. GOVERNING LAW AND JURISDICTION 9.1 A ny dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 F rench law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.

Sensors & Technologies for The Internet of Things

Recommend Documents