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Connector for microSD™ Card (Push-push Type) SCHA Series Compact low-profile type most suitable for mobile phones. For SD Memory Card
NEW
For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™
Typical Specifications Items
Specifications
Applicable media
For Memory Stick™
microSD™ Card
Mounting type
Surface mounting type
Combine Type
Mounting style
Standard mount/ Reverse mount
For Compact Flash™
Media ejection structure Operating temperature range
Connector for microSD™ Card (Push-push Type) SCHA Series
Dimensions Standard mount
Unit:mm
No.
PC board mounting hole dimensions (Viewed from the mounting face side)
Style With switch
!
"# $
For microSD™ Card
%& $ 1
For SD Memory Card
- . . ! ,( *% →)*%++ PIN
SD Mode
PIN
SD Mode
#1
DAT2
#5
CLK
#2
DAT3/CD
#6
VSS
#3
CMD
#7
DAT0
#4
VDD
#8
DAT1
' / % ' /
For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For CMOS Camera Module
' ( With switches and fly-out protection.
2
$
0 1 1 $ ! $*
"#%& '
"#
"#() '
!
" #
. / ,( → +,(--
538
Connector for microSD™ Card (Push-push Type) SCHA Series
Dimensions Reverse mount
Unit:mm
No.
Style Slim type with switch
Combine Type For Compact Flash™ For CMOS Camera Module
539
1.2
0.14 0.9 0.9
Pin assignments PIN
SD Mode
PIN
SD Mode
#1
DAT2
#5
CLK
#2
DAT3/CD
#6
VSS
#3
CMD
#7
DAT0
#4
VDD
#8
DAT1
2.1 1.1
3.775 2.575 0.5
2 3.9
0.3 1.2
0.9 0.9
13.6
#5#6#7#8 #1#2#3 #4 Circuit Diafram for Detect Switch Insertiong Detect Switch Card=ON Common →Normal=OFF
14.5 13.6
0.15
5.975
0.3
14.4 13.6 12.9 10.235 2.6 P=0.7 0.7 8-0.45 2
#8 #7 #6 #5 #4 #3 #2 #1
3.425 0.5
0.8 0.2
Externals
1.6 2.6
13.6 10.235 P=0.7 8-0.25 3.9 1.6
3.425 Card detect switch
2-1
1.5 2.1
(0.875)
5.975
0.6
Connector center microSD Card center
2-1.1
3
(2.6)
(0.9)Over stroke 15
For W-SIM
For Memory Stick™
3.775 2-0.3 2.575 Common
1.51
2.1
15 13.9
For SIM Card 8pins
0.5
For microSD™ Card
(3.3)Eject stroke
For SD Memory Card
For Memory Stick Micro™
PC board mounting hole dimensions (Viewed from the mounting face side)
0.6
10.6 13.275
0.6 1.1
NO Pattern Area Land Area P.C.B cut on the point of CARD interference.
Small Memory Card Connectors
Soldering Conditions Example of Reflow Soldering Condition(Reference)
For SD Memory Card
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA(K)or CC(T). 3. Temperature profile(Surface of products).
For microSD™ Card
For W-SIM For Memory Stick Micro™ For Memory Stick™
Temperature (˚C )
For SIM Card 8pins
240℃(max.) 230℃(min.) 200 180℃ 150℃ 100
Room temperature
Time (s) Pre-heating 90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For Compact Flash™ For CMOS Camera Module
Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
565
Mouser Electronics Authorized Distributor
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