Connector for microSD(TM) Card (Push-push Type)

Connector for microSD™ Card (Push-push Type) SCHA Series Compact low-profile type most suitable for mobile phones. For SD Memory Card

NEW

For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™

Typical Specifications Items

Specifications

Applicable media

For Memory Stick™

microSD™ Card

Mounting type

Surface mounting type

Combine Type

Mounting style

Standard mount/ Reverse mount

For Compact Flash™

Media ejection structure Operating temperature range

Structure

Push-push type −20℃ to ＋70℃

Voltage proof

For CMOS Camera Module

500V AC 1minute

Insulation resistance （Initial） Connector Contact contacts resistance Detection （Initial） switch Insertion and removal cycle

Performance

1,000MΩ min. 100mΩ max. 500mΩ max. 5,000cycles

Product Line Media ejection structure

Mounting system

Stand-off （mm）

Features

Packing system

With switch Standard mount Push-push type Reverse mount

With switches and fly-out protection.

0

Taping

With switch

Product No.

Drawing No.

SCHA4B0100

1

SCHA4B0400

2

SCHA5B0200

3

Packing Specifications Taping Unit:mm Reel size

Product No. SCHA4B0100 SCHA4B0400 SCHA5B0200 ¿380

537

W

Export Reel Tape package width width measurements 1 case W（mm） （mm） （mm） /export packing

Number of packages（pcs.） 1 reel

1 case /Japan

2,000

6,000

12,000

1,500

4,500

9,000

24.4

24

403

403 249

Connector for microSD™ Card (Push-push Type) SCHA Series

Dimensions Standard mount

Unit:mm

No.

PC board mounting hole dimensions （Viewed from the mounting face side）

Style With switch

 

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For microSD™ Card



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For SD Memory Card



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SD Mode

PIN

SD Mode

#1

DAT2

#5

CLK

#2

DAT3/CD

#6

VSS

#3

CMD

#7

DAT0

#4

VDD

#8

DAT1

  


 





 

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For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For CMOS Camera Module

' ( With switches and fly-out protection.




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538

Connector for microSD™ Card (Push-push Type) SCHA Series

Dimensions Reverse mount

Unit:mm

No.

Style Slim type with switch

Combine Type For Compact Flash™ For CMOS Camera Module

539

1.2

0.14 0.9 0.9

Pin assignments PIN

SD Mode

PIN

SD Mode

#1

DAT2

#5

CLK

#2

DAT3/CD

#6

VSS

#3

CMD

#7

DAT0

#4

VDD

#8

DAT1

2.1 1.1

3.775 2.575 0.5

2 3.9

0.3 1.2

0.9 0.9

13.6

#5#6#7#8 #1#2#3 #4 Circuit Diafram for Detect Switch Insertiong Detect Switch Card=ON Common →Normal=OFF

14.5 13.6

0.15

5.975

0.3

14.4 13.6 12.9 10.235 2.6 P=0.7 0.7 8-0.45 2

#8 #7 #6 #5 #4 #3 #2 #1

3.425 0.5

0.8 0.2

Externals

1.6 2.6

13.6 10.235 P=0.7 8-0.25 3.9 1.6

3.425 Card detect switch

2-1

1.5 2.1

(0.875)

5.975

0.6

Connector center microSD Card center

2-1.1

3

(2.6)

(0.9)Over stroke 15

For W-SIM

For Memory Stick™

3.775 2-0.3 2.575 Common

1.51

2.1

15 13.9

For SIM Card 8pins

0.5

For microSD™ Card

(3.3)Eject stroke

For SD Memory Card

For Memory Stick Micro™

PC board mounting hole dimensions （Viewed from the mounting face side）

0.6

10.6 13.275

0.6 1.1

NO Pattern Area Land Area P.C.B cut on the point of CARD interference.

Small Memory Card Connectors

Soldering Conditions Example of Reflow Soldering Condition（Reference）

For SD Memory Card

1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）.

For microSD™ Card

For W-SIM For Memory Stick Micro™ For Memory Stick™

Temperature (˚C )

For SIM Card 8pins

240℃(max.) 230℃(min.) 200 180℃ 150℃ 100

Room temperature

Time (s) Pre-heating 90±30 sec.

10 sec.(max.)

Combine Type

Heating time

sec.

For Compact Flash™ For CMOS Camera Module

Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.

565

Mouser Electronics Authorized Distributor

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ALPS: SCHA4B0400 SCHA5B0200 SCHA1B0100 SCHA4B0100 SCHA1A0101 SCHA2B0300