4.5 Ω RON, Triple/Quad SPDT ±5 V, +12 V, +5 V, and +3.3 V Switches ADG1633/ADG1634
Data Sheet
FUNCTIONAL BLOCK DIAGRAMS
4.5 Ω typical on resistance 1 Ω on-resistance flatness Up to 206 mA continuous current ±3.3 V to ±8 V dual-supply operation 3.3 V to 16 V single-supply operation No VL supply required 3 V logic-compatible inputs Rail-to-rail operation ADG1633 16-lead TSSOP and 16-lead, 3 mm × 3 mm LFCSP ADG1634 20-lead TSSOP and 20-lead, 4 mm × 4 mm LFCSP
APPLICATIONS
ADG1633 S1A D1 S1B S3B D3 S2B
S3A
D2 S2A LOGIC
IN1 IN2 IN3 EN 08319-001
FEATURES
SWITCHES SHOWN FOR A 1 INPUT LOGIC.
Figure 1. ADG1633 TSSOP and LFCSP
Communication systems Medical systems Audio signal routing Video signal routing Automatic test equipment Data acquisition systems Battery-powered systems Sample-and-hold systems Relay replacements
ADG1634 S1A
S4A
D1
D4
S1B
S4B
IN1
IN4
IN2
IN3
S2B
S3B
D2
The ADG1633 and ADG1634 are monolithic industrial CMOS (iCMOS®) analog switches comprising three independently selectable single-pole, double-throw (SPDT) switches and four independently selectable SPDT switches, respectively. All channels exhibit break-before-make switching action that prevents momentary shorting when switching channels. An EN input on the ADG1633 (LFCSP and TSSOP packages) and ADG1634 (LFCSP package only) is used to enable or disable the devices. When disabled, all channels are switched off. The ultralow on resistance and on-resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications, where low distortion is critical. iCMOS construction ensures ultralow power dissipation, making the parts ideally suited for portable and battery-powered instruments.
D3
S2A
S3A
08319-002
GENERAL DESCRIPTION
SWITCHES SHOWN FOR A 1 INPUT LOGIC.
Figure 2. ADG1634 TSSOP
ADG1634 S4A
S1A
D4
D1
S4B
S1B
S3B
S2B
D3
D2
S3A
S2A
IN1 IN2 IN3 IN4 EN SWITCHES SHOWN FOR A 1 INPUT LOGIC.
08319-003
LOGIC
Figure 3. ADG1634 LFCSP
Rev. B
Document Feedback
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ADG1633/ADG1634
Data Sheet
TABLE OF CONTENTS Features .............................................................................................. 1
Continuous Current per Channel, S or D ..................................7
Applications ....................................................................................... 1
Absolute Maximum Ratings ............................................................8
General Description ......................................................................... 1
ESD Caution...................................................................................8
Functional Block Diagrams ............................................................. 1
Pin Configurations and Function Descriptions ............................9
Revision History ............................................................................... 2
Typical Performance Characteristics ........................................... 11
Specifications..................................................................................... 3
Test Circuits ..................................................................................... 14
±5 V Dual Supply ......................................................................... 3
Terminology .................................................................................... 16
12 V Single Supply ........................................................................ 4
Outline Dimensions ....................................................................... 17
5 V Single Supply .......................................................................... 5
Ordering Guide .......................................................................... 19
3.3 V Single Supply ....................................................................... 6
REVISION HISTORY 8/2016—Rev. A to Rev. B Changed CP-20-4 to CP-20-10 .................................... Throughout Changes to Figure 5 .......................................................................... 9 Changes to Figure 7 ........................................................................ 10 Updated Outline Dimensions ....................................................... 18 Changes to Ordering Guide .......................................................... 19 9/2014—Rev. 0 to Rev. A Changes to Figure 26, Figure 27, Figure 28 ................................. 14 Updated Outline Dimensions ....................................................... 17 Changes to Ordering Guide .......................................................... 19 7/2009—Revision 0: Initial Version
Rev. B | Page 2 of 19
Data Sheet
ADG1633/ADG1634
SPECIFICATIONS ±5 V DUAL SUPPLY VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted. Table 1. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source Off Leakage, IS (Off ) Drain Off Leakage, ID (Off ) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH
25°C
−40°C to +85°C
−40°C to +125°C VDD to VSS
4.5 5 0.12 0.25 1 1.3 ±0.01 ±0.1 ±0.02 ±0.15 ±0.02 ±0.15
7
8
0.3
0.35
1.7
2
±1.5
±12
±2
±20
±2
±20 2.0 0.8
±1 ±0.1
Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 Transition Time, tTRANSITION
8
V Ω typ Ω max Ω typ Ω max Ω typ Ω max nA typ nA max nA typ nA max nA typ nA max V min V max nA typ µA max pF typ
Break-Before-Make Time Delay, tD
161 200 61 79 162 199 44
Charge Injection Off Isolation
−12.5 −64
ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ
Channel-to-Channel Crosstalk
−64
dB typ
Total Harmonic Distortion + Noise (THD + N)
0.3
% typ
103 19 33 57
MHz typ pF typ pF typ pF typ
tON (EN) tOFF (EN)
236
264
88
98
232
259 30
−3 dB Bandwidth CS (Off ) CD (Off ) CD, CS (On) POWER REQUIREMENTS IDD VDD/VSS 1
Unit
0.001 1.0 ±3.3/±8
Guaranteed by design, but not subject to production test. Rev. B | Page 3 of 19
µA typ µA max V min/max
Test Conditions/Comments
VS = ±4.5 V, IS = −10 mA; see Figure 26 VDD = ±4.5 V, VSS = ±4.5 V VS = ±4.5 V, IS = −10 mA VS = ±4.5 V, IS = −10 mA VDD = +5.5 V, VSS = −5.5 V VS = ±4.5 V, VD = ±4.5 V; see Figure 27 VS = ±4.5V, VD = ±4.5 V; see Figure 27 VS = VD = ±4.5 V; see Figure 28
VIN = VGND or VDD
RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 29 RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 2.5 V; see Figure 30 VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 32 RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 33 RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 35 RL = 110 Ω, VS = 5 V p-p, f = 20 Hz to 20 kHz; see Figure 36 RL = 50 Ω, CL = 5 pF; see Figure 34 VS = 0 V, f = 1 MHz VS = 0 V, f = 1 MHz VS = 0 V, f = 1 MHz VDD = +5.5 V, VSS = −5.5 V Digital inputs = 0 V or VDD
ADG1633/ADG1634
Data Sheet
12 V SINGLE SUPPLY VDD = 12 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 2. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source Off Leakage, IS (Off) Drain Off Leakage, ID (Off) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 Transition Time, tTRANSITION tON (EN) tOFF (EN) Break-Before-Make Time Delay, tD
25°C
−40°C to +85°C
−40°C to +125°C 0 V to VDD
4 4.5 0.12 0.25 0.9 1.2 ±0.01 ±0.1 ±0.02 ±0.15 ±0.02 ±0.15
6.5
7.5
0.3
0.35
1.6
1.9
±1.5
±12
±2
±20
±2
±20 2.0 0.8
V min V max
±0.1
µA max pF typ
nA typ
8
−64 −64 0.3
ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % typ
109 19 32 56
MHz typ pF typ pF typ pF typ
182
205
43
47
180
200 30
Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion + Noise (THD + N) −3 dB Bandwidth CS (Off) CD (Off) CD, CS (On) POWER REQUIREMENTS IDD
−12.4
0.001 1.0
TSSOP
300 480
LFCSP VDD 1
V Ω typ Ω max Ω typ Ω max Ω typ Ω max nA typ nA max nA typ nA max nA typ nA max
±1
127 151 31 38 128 152 45
Unit
375 600 3.3/16
Guaranteed by design, but not subject to production test.
Rev. B | Page 4 of 19
µA typ µA max µA typ µA max µA typ µA max V min/max
Test Conditions/Comments
VS = 0 V to 10 V, IS = −10 mA; see Figure 26 VDD = 10.8 V, VSS = 0 V VS = 10 V, IS = −10 mA VS = 0 V to 10 V, IS = −10 mA VDD = 13.2 V, VSS = 0 V VS = 1 V/10 V, VD = 10 V/1 V; see Figure 27 VS = 1 V/10 V, VD = 10 V/1 V; see Figure 27 VS = VD = 1 V or 10 V; see Figure 28
VIN = VGND or VDD
RL = 300 Ω, CL = 35 pF VS = 8 V; see Figure 29 RL = 300 Ω, CL = 35 pF VS = 8 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS = 8 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 8 V; see Figure 30 VS = 6 V, RS = 0 Ω, CL = 1 nF; see Figure 32 RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 33 RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 35 RL = 110 Ω, VS = 5 V p-p, f = 20 Hz to 20 kHz; see Figure 36 RL = 50 Ω, CL = 5 pF; see Figure 34 VS = 6 V, f = 1 MHz VS = 6 V, f = 1 MHz VS = 6 V, f = 1 MHz VDD = 12 V Digital inputs = 0 V or VDD Digital inputs = 5 V Digital inputs = 5 V
Data Sheet
ADG1633/ADG1634
5 V SINGLE SUPPLY VDD = 5 V ± 10%, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 3. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source Off Leakage, IS (Off ) Drain Off Leakage, ID (Off ) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH
25°C
−40°C to +85°C
−40°C to +125°C 0 V to VDD
8.5 10 0.15 0.3 1.7 2.3 ±0.01 ±0.1 ±0.02 ±0.15 ±0.02 ±0.15
12.5
14
0.35
0.4
2.7
3
±1.5
±12
±2
±20
±2
±20 2.0 0.8
±1 ±0.1
Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 Transition Time, tTRANSITION
8
V Ω typ Ω max Ω typ Ω max Ω typ Ω max nA typ nA max nA typ nA max nA typ nA max V min V max nA typ µA max pF typ
Break-Before-Make Time Delay, tD
199 254 68 90 201 256 57
Charge Injection Off Isolation Channel-to-Channel Crosstalk Total Harmonic Distortion + Noise (THD + N)
−5 −64 −64 0.27
ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ % typ
104 21 37 62
MHz typ pF typ pF typ pF typ
tON (EN) tOFF (EN)
303
337
102
110
300
333 37
−3 dB Bandwidth CS (Off ) CD (Off ) CD, CS (On) POWER REQUIREMENTS IDD VDD 1
Unit
0.001 1.0 3.3/16
Guaranteed by design, but not subject to production test.
Rev. B | Page 5 of 19
µA typ µA max V min/max
Test Conditions/Comments
VS = 0 V to 4.5 V, IS = −10 mA; see Figure 26 VDD = 4.5 V, VSS = 0 V VS = 0 V to 4.5 V, IS = −10 mA VS = 0 V to 4.5 V, IS = −10 mA VDD = 5.5 V, VSS = 0 V VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 27 VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 27 VS = VD = 1 V or 4.5 V; see Figure 28
VIN = VGND or VDD
RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 29 RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS = 2.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 2.5 V; see Figure 30 VS = 2.5 V, RS = 0 Ω, CL = 1 nF; see Figure 32 RL = 50 Ω, CL = 5 pF, f = 100 kHz; see Figure 33 RL = 50 Ω, CL = 5 pF, f = 100 kHz; see Figure 35 RL = 110 Ω, f = 20 Hz to 20 kHz, VS = 3.5 V p-p; see Figure 36 RL = 50 Ω, CL = 5 pF; see Figure 34 VS = 2.5 V, f = 1 MHz VS = 2.5 V, f = 1 MHz VS = 2.5 V, f = 1 MHz VDD = 5.5 V Digital inputs = 0 V or VDD
ADG1633/ADG1634
Data Sheet
3.3 V SINGLE SUPPLY VDD = 3.3 V, VSS = 0 V, GND = 0 V, unless otherwise noted. Table 4. Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON)
25°C
−40°C to +85°C
−40°C to +125°C
Unit
13.5
15
0 V to VDD 16.5
V Ω typ
On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source Off Leakage, IS (Off )
0.25 5
0.28 5.5
0.3 6.5
Ω typ Ω typ
±1.5
±12
±2
±20
±2
±20
Drain Off Leakage, ID (Off ) Channel On Leakage, ID, IS (On) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current, IINL or IINH
±0.01 ±0.1 ±0.01 ±0.15 ±0.01 ±0.15
2.0 0.8 ±1 ±0.1
Digital Input Capacitance, CIN DYNAMIC CHARACTERISTICS 1 Transition Time, tTRANSITION
8
V min V max nA typ µA max pF typ
Break-Before-Make Time Delay, tD
309 429 132 184 313 416 81
Charge Injection Off Isolation
−10 −64
ns typ ns max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ
Channel-to-Channel Crosstalk
−64
dB typ
Total Harmonic Distortion + Noise (THD + N)
0.6
% typ
117 22 39 64
MHz typ pF typ pF typ pF typ
tON (EN) tOFF (EN)
466
508
201
210
470
509 48
−3 dB Bandwidth CS (Off ) CD (Off ) CD, CS (On) POWER REQUIREMENTS IDD VDD 1
nA typ nA max nA typ nA max nA typ nA max
0.001 1.0 3.3/16
Guaranteed by design, but not subject to production test.
Rev. B | Page 6 of 19
µA typ µA max V min/max
Test Conditions/Comments
VS = 0 V to VDD, IS = −10 mA; see Figure 26, VDD = 3.3 V, VSS = 0 V VS = 0 V to VDD, IS = −10 mA VS = 0 V to VDD, IS = −10 mA VDD = 3.6 V, VSS = 0 V VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 27 VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 27 VS = VD = 0.6 V or 3 V; see Figure 28
VIN = VGND or VDD
RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 29 RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS = 1.5 V; see Figure 31 RL = 300 Ω, CL = 35 pF VS1 = VS2 = 1.5 V; see Figure 30 VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 32 RL = 50 Ω, CL = 5 pF, f = 100 kHz; see Figure 33 RL = 50 Ω, CL = 5 pF, f = 100 kHz; see Figure 35 RL = 110 Ω, f = 20 Hz to 20 kHz, VS = 2 V p-p; see Figure 36 RL = 50 Ω, CL = 5 pF; see Figure 34 VS = 1.5 V, f = 1 MHz VS = 1.5 V, f = 1 MHz VS = 1.5 V, f = 1 MHz VDD = 3.6 V Digital inputs = 0 V or VDD
Data Sheet
ADG1633/ADG1634
CONTINUOUS CURRENT PER CHANNEL, S OR D Table 5. ADG1633 Parameter CONTINUOUS CURRENT, S OR D VDD = +5 V, VSS = −5 V TSSOP (θJA = 112.6°C/W) LFCSP (θJA = 48.7°C/W) VDD = 12 V, VSS = 0 V TSSOP (θJA = 112.6°C/W) LFCSP (θJA = 48.7°C/W) VDD = 5 V, VSS = 0 V TSSOP (θJA = 112.6°C/W) LFCSP (θJA = 48.7°C/W) VDD = 3.3 V, VSS = 0 V TSSOP (θJA = 112.6°C/W) LFCSP (θJA = 48.7°C/W)
25°C
85°C
125°C
Unit
126 206
84 126
56 70
mA max mA max
133 213
87 133
56 73
mA max mA max
98 157
70 105
45 63
mA max mA max
77 129
56 87
38 56
mA max mA max
25°C
85°C
125°C
Unit
112 220
77 136
52 73
mA max mA max
119 234
80 140
52 73
mA max mA max
87 171
63 112
42 66
mA max mA max
70 140
52 94
35 59
mA max mA max
Table 6. ADG1634 Parameter CONTINUOUS CURRENT, S OR D VDD = +5 V, VSS = −5 V TSSOP (θJA = 95°C/W) LFCSP (θJA = 30.4°C/W) VDD = 12 V, VSS = 0 V TSSOP (θJA = 95°C/W) LFCSP (θJA = 30.4°C/W) VDD = 5 V, VSS = 0 V TSSOP (θJA = 95°C/W) LFCSP (θJA = 30.4°C/W) VDD = 3.3 V, VSS = 0 V TSSOP (θJA = 95°C/W) LFCSP (θJA = 30.4°C/W)
Rev. B | Page 7 of 19
ADG1633/ADG1634
Data Sheet
ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 7. Parameter VDD to VSS VDD to GND VSS to GND Analog Inputs 1 Digital Inputs1 Peak Current, S or D Continuous Current, S or D 2 Operating Temperature Range Industrial (Y Version) Storage Temperature Range Junction Temperature 16-Lead TSSOP, θJA Thermal Impedance, 0 Airflow (4Layer Board) 20-Lead TSSOP, θJA Thermal Impedance, 0 Airflow (4-Layer Board) 16-Lead LFCSP (3 mm × 3 mm), θJA Thermal Impedance, 0 Airflow (4-Layer Board) 16-Lead LFCSP (4 mm × 4 mm), θJA Thermal Impedance, 0 Airflow (4-Layer Board) Reflow Soldering Peak Temperature, Pb free
Rating 18 V −0.3 V to +18 V +0.3 V to −18 V VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first GND − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first 450 mA (pulsed at 1 ms, 10% duty cycle maximum) Data + 15%
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
ESD CAUTION
−40°C to +125°C −65°C to +150°C 150°C 112.6°C/W 95°C/W 48.7°C/W 30.4°C/W 260°C
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. 2 See Table 5 and Table 6. 1
Rev. B | Page 8 of 19
Data Sheet
ADG1633/ADG1634
10 S3B
9
IN3
08319-004
10 S3A
8
13 IN1
TOP VIEW (Not to Scale)
9
D2 4
11 D3
D2 6 S2A 7 IN2
S2B 3
D3
NOTES 1. EXPOSED PAD IS TIED TO THE SUBSTRATE, VSS.
Figure 4. ADG1633 TSSOP Pin Configuration
08319-005
12 S3B
11 VSS
IN3 7
S2B 5
TOP VIEW (Not to Scale)
AD1633
S3A 8
13 VSS
S1B 2
S2A 5
ADG1633
12 EN
D1 1
14 EN
D1 3 S1B 4
14 GND
16 S1A 16 GND 15 IN1
IN2 6
VDD 1 S1A 2
15 VDD
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Figure 5. ADG1633 LFCSP Pin Configuration
Table 8. ADG1633 Pin Function Descriptions Pin No. TSSOP LFCSP 1 15 2 16 3 1 4 2 5 3 6 4 7 5 8 6 9 7 10 8 11 9 12 10 13 11 14 12
Mnemonic VDD S1A D1 S1B S2B D2 S2A IN2 IN3 S3A D3 S3B VSS EN
15 16 N/A
IN1 GND EP
13 14 17
Description Most Positive Power Supply Potential. Source Terminal 1A. Can be an input or an output. Drain Terminal 1. Can be an input or an output. Source Terminal 1B. Can be an input or an output. Source Terminal 2B. Can be an input or an output. Drain Terminal 2. Can be an input or an output. Source Terminal 2A. Can be an input or an output. Logic Control Input 2. Logic Control Input 3. Source Terminal 3A. Can be an input or an output. Drain Terminal 3. Can be an input or an output. Source Terminal 3B. Can be an input or an output. Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. Active Low Digital Input. When this pin is high, the device is disabled and all switches are off. When this pin is low, INx logic inputs determine the on switches. Logic Control Input 1. Ground (0 V) Reference. Exposed Pad. The exposed pad is tied to the substrate, VSS.
Table 9. ADG1633 Truth Table EN 1 0 0 1
INx X1 0 1
SxA Off Off On
SxB Off On Off
X = don’t care.
Rev. B | Page 9 of 19
18
D4
S1B 4
17
S4B VDD
VSS 5
ADG1634
16
GND 6
TOP VIEW (Not to Scale)
15
NC
14
S3B
S2B 7
13
D3
12
S3A
IN2 10
11
IN3 08319-006
D2 8 S2A 9
D1 1 S1B 2 VSS 3 GND 4 S2B 5
NC = NO CONNECT
ADG1634 TOP VIEW (Not to Scale)
15 14 13 12 11
D4 S4B VDD S3B D3
NOTES 1. EXPOSED PAD IS TIED TO THE SUBSTRATE, VSS.
08319-007
S4A
D1 3
S1A
20 19 18 17 16
IN4
19
6 7 8 9 10
20
2
D2 S2A IN2 IN3 S3A
IN1 1
Data Sheet S1A IN1 EN IN4 S4A
ADG1633/ADG1634
Figure 7. ADG1634 LFCSP Pin Configuration
Figure 6. ADG1634 TSSOP Pin Configuration
Table 10. ADG1634 Pin Function Descriptions Pin No. TSSOP LFCSP 1 19 2 20 3 1 4 2 5 3 6 4 7 5 8 6 9 7 10 8 11 9 12 10 13 11 14 12 15 N/A 16 13 17 14 18 15 19 16 20 17 N/A 18
Mnemonic IN1 S1A D1 S1B VSS GND S2B D2 S2A IN2 IN3 S3A D3 S3B NC VDD S4B D4 S4A IN4 EN
N/A
EP
21
Description Logic Control Input 1. Source Terminal 1A. Can be an input or an output. Drain Terminal 1. Can be an input or an output. Source Terminal 1B. Can be an input or an output. Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. Ground (0 V) Reference. Source Terminal 2B. Can be an input or an output. Drain Terminal 2. Can be an input or an output. Source Terminal 2A. Can be an input or an output. Logic Control Input 2. Logic Control Input 3. Source Terminal 3A. Can be an input or an output. Drain Terminal 3. Can be an input or an output. Source Terminal 3B. Can be an input or an output. No Connect. Most Positive Power Supply Potential. Source Terminal 4B. Can be an input or an output. Drain Terminal 4. Can be an input or an output. Source Terminal 4A. Can be an input or an output. Logic Control Input 4. Active Low Digital Input. When this pin is high, the device is disabled and all switches are off. When this pin is low, INx logic inputs determine the on switches. Exposed Pad. The exposed pad is tied to the substrate, VSS.
Table 11. ADG1634 TSSOP Truth Table INx 0 1
SxA Off On
SxB On Off
SxA Off Off On
SxB Off On Off
Table 12. ADG1634 LFCSP Truth Table EN 1 0 0 1
INx X1 0 1
X = don’t care. Rev. B | Page 10 of 19
Data Sheet
ADG1633/ADG1634
TYPICAL PERFORMANCE CHARACTERISTICS 7
7 VDD = 12V VSS = 0V
TA = 25°C
6
5 VDD = +3.3V VSS = –3.3V
4
3
VDD = +5V VSS = –5V
2
VDD = +8V VSS = –8V
5
ON RESISTANCE (Ω)
TA = +125°C
4
TA = +85°C TA = +25°C
3
TA = –40°C
2
1
–8
–4
–6
–2
0
4
2
6
8
SOURCE OR DRAIN VOLTAGE (V)
0
08319-029
0
2
0
4
6
Figure 8. On Resistance vs. VD (VS), Dual Supply
12
10
Figure 11. On Resistance vs. VD (VS) for Different Temperatures, 12 V Single Supply
16
12
TA = 25°C
VDD = 3.3V VSS = 0V
14
10 TA = +125°C
ON RESISTANCE (Ω)
12
ON RESISTANCE (Ω)
8
SOURCE OR DRAIN VOLTAGE (V)
08319-032
1
10 VDD = 5V VSS = 0V
8 6
VDD = 16V VSS = 0V
VDD = 12V VSS = 0V
4
TA = +85°C
8
TA = +25°C
6
TA = –40°C
4
2
2
VDD = 5V VSS = 0V
0
2
6
4
8
12
10
14
16
SOURCE OR DRAIN VOLTAGE (V)
0
08319-030
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
SOURCE OR DRAIN VOLTAGE (V)
Figure 9. On Resistance vs. VD (VS), Single Supply
08319-033
ON RESISTANCE (Ω)
6
Figure 12. On Resistance vs. VD (VS) for Different Temperatures, 5 V Single Supply
7
18
VDD = +5V VSS = –5V
VDD = 3.3V VSS = 0V
16
6
ON RESISTANCE (Ω)
TA = +85°C 4 TA = +25°C 3
TA = –40°C
2
12
TA = +125°C TA = +85°C TA = +25°C TA = –40°C
10 8 6 4
1
–4
–3
–2
–1
0
1
2
3
4
5
SOURCE OR DRAIN VOLTAGE (V)
Figure 10. On Resistance vs. VD (VS) for Different Temperatures, ±5 V Dual Supply
0 0
0.5
1.0
1.5
2.0
2.5
3.0
SOURCE OR DRAIN VOLTAGE (V)
Figure 13. On Resistance vs. VD (VS) for Different Temperatures, 3.3 V Single Supply
Rev. B | Page 11 of 19
08319-021
0 –5
2 08319-031
ON RESISTANCE (Ω)
14
TA = +125°C
5
ADG1633/ADG1634
Data Sheet
12
10 VDD = +5V VSS = –5V VBIAS = +4.5V/–4.5V
8
6 4
LEAKAGE CURRENT (nA)
ID (OFF) – + ID, IS (ON) + + IS (OFF) + –
2 0 –2 ID, IS (ON) – – IS (OFF) – + ID (OFF) + –
–4 –6 40
60
80
100
4
2
0
–8 20
120
TEMPERATURE (°C)
–2 0
20
80
60
120
100
Figure 17. ADG1633 Leakage Currents vs. Temperature, 3.3 V Single Supply
15
600
VDD = 12V VSS = 0V VBIAS = 1V/10V
IDD PER CHANNEL TA = 25°C IDD = +12V ISS = 0V
500
10 ID, IS (ON) + + ID (OFF) – + IS (OFF) + –
400
IDD (µA)
300 IDD = +5V ISS = –5V
0 200
IDD = +5V ISS = 0V
ID, IS (ON) – – IS (OFF) – + ID (OFF) + –
20
40
60
80
100
120
TEMPERATURE (°C)
0
08319-034
–10 0
IDD = +3.3V ISS = 0V
100
0
2
4
6
8
10
12
14
LOGIC (V)
08319-020
5
–5
Figure 18. IDD vs. Logic Level
Figure 15. ADG1633 Leakage Currents vs. Temperature, 12 V Single Supply 100
10 VDD = 5V VSS = 0V VBIAS = 1V/4.5V
8
80
6
CHARGE INJECTION (pC)
60
ID, IS (ON) + + ID (OFF) – + ID (OFF) + – IS (OFF) + – IS (OFF) – + ID, IS (ON) – –
4
2
VDD = +5V VSS = –5V
40
VDD = +5V VSS = 0V
20 VDD = +3.3V VSS = 0V
0
VDD = +12V VSS = 0V
–20 –40 –60 –80
0
–2 0
20
40
60
80
100
120
TEMPERATURE (°C)
–120 –6
–4
–2
0
2
4
6
8
10
12
VS (V)
Figure 16. ADG1633 Leakage Currents vs. Temperature, 5 V Single Supply
Figure 19. Charge Injection vs. Source Voltage
Rev. B | Page 12 of 19
14
08319-027
–100 08319-036
LEAKAGE CURRENT (nA)
40
TEMPERATURE (°C)
Figure 14. ADG1633 Leakage Currents vs. Temperature, ±5 V Dual Supply
LEAKAGE CURRENT (nA)
ID, IS (ON) + + ID, IS (ON) – – ID (OFF) – + IS (OFF) + – ID (OFF) + – IS (OFF) – +
6
08319-035
LEAKAGE CURRENT (nA)
8
0
VDD = 3.3V VSS = 0V VBIAS = 0.6V/3V
08319-019
10
Data Sheet
ADG1633/ADG1634
350
0 TA = 25°C VDD = +5V VSS = –5V
TA = 25°C VDD = +3.3V, VSS = 0V VDD = +5V, VSS = 0V VDD = +5V, VSS = –5V VDD = +12V, VSS = 0V
250
–1
INSERTION LOSS (dB)
200
150
100
–2
–3
–4
–20
0
20
40
60
80
100
120
TEMPERATURE (°C)
–6 10k
08319-025
0 –40
0.7 TA = 25°C VDD = +5V VSS = –5V
100M
1G
LOAD = 110Ω TA = 25°C
0.6
VDD = +3.3V, VS = 2V p-p
–20
0.5 –30
THD + N (%)
–40 –50
0.4
0.3
VDD = +5V, VS = 3.5V p-p
–60
0.2 –70
VDD = +5V, VSS = –5V, VS = 5V p-p 0.1
–80
100k
1M
10M
100M
1G
FREQUENCY (Hz)
0
08319-023
–90 10k
VDD = +12V, VS = 5V p-p
0
5k
–10
15k
20k
Figure 24. THD + N vs. Frequency
Figure 21. Off Isolation vs. Frequency
0
10k FREQUENCY (Hz)
08319-028
OFF ISOLATION (dB)
10M
Figure 23. On Response vs. Frequency
0
0
TA = 25°C VDD = +5V VSS = –5V
–20
TA = 25°C VDD = +5V VSS = –5V NO DECOUPLING CAPACITORS
–20 –40
ACPSRR (dB)
–30 –40 –50
–60
–80
–60
DECOUPLING CAPACITORS
–70 –100
–80 –90 10k
100k
1M
10M
100M
FREQUENCY (Hz)
1G
08319-024
CROSSTALK (dB)
1M
FREQUENCY (Hz)
Figure 20. Transition Time vs. Temperature
–10
100k
08319-022
–5
50
–120 1k
10k
100k
1M
FREQUENCY (Hz)
Figure 25. ACPSRR vs. Frequency
Figure 22. Crosstalk vs. Frequency
Rev. B | Page 13 of 19
10M
100M
08319-026
TRANSITION TIME (ns)
300
ADG1633/ADG1634
Data Sheet
TEST CIRCUITS S
D
IDS RON = V ÷ IDS
Figure 27. Off Leakage
ID (ON)
S1
NC
D S2
VS
A
08319-010
VD
Figure 28. On Leakage
VDD
VSS
VDD
VIN
50%
50%
VIN
50%
50%
VSS
SB
VS
0.1µF
D
SA
VOUT RL 100Ω
IN
CL 35pF
90%
90%
VOUT
tON
tOFF
08319-011
GND
VIN
Figure 29. Switching Timing
0.1µF
VDD
VSS
VDD
VSS
SB
VS
0.1µF VIN
D
SA
VOUT RL 100Ω
IN
VOUT 80%
CL 35pF
tBBM
GND
tBBM 08319-012
VIN
Figure 30. Break-Before-Make Delay, tD
VDD
VSS
VDD
VSS
0.1µF 3V ENABLE DRIVE (VIN)
ADG1633 INx
S1A
INx
S1B
VS
VOUT
INx
VIN
50Ω
VOUT
D1
EN GND
50%
50%
0V
RL 100Ω
CL 35pF
OUTPUT 0V
Figure 31. Enable Delay, tON (EN), tOFF (EN) Rev. B | Page 14 of 19
tOFF (EN) 0.9VOUT
tON (EN)
0.9VOUT 08319-013
0.1µF
A
VD
VS
Figure 26. On Resistance
0.1µF
ID (OFF)
SB
A
D
08319-008
VS
SA
A
08319-009
IS (OFF)
V
Data Sheet
ADG1633/ADG1634
VS
VDD
VSS
VDD
VSS
0.1µF VIN (NORMALLY CLOSED SWITCH)
SB
D
NC
SA CL 1nF
IN
VOUT
OFF
VIN (NORMALLY OPEN SWITCH) VOUT
GND
VIN
ON
∆VOUT
QINJ = CL × ∆VOUT
08319-014
0.1µF
Figure 32. Charge Injection
VDD VDD
VSS SA
NETWORK ANALYZER
NETWORK ANALYZER NC
SB
VOUT
VDD SA
RL 50Ω
50Ω
D SB
50Ω VS
D
VIN
OFF ISOLATION = 20 log
VOUT VS
GND
CHANNEL-TO-CHANNEL CROSSTALK = 20 log
Figure 33. Off Isolation
R 50Ω
IN
VS
VOUT
08319-015
RL 50Ω
GND
VDD
VSS
VOUT VS
08319-017
VDD
Figure 35. Channel-to-Channel Crosstalk
VSS 0.1µF VDD
VDD
VSS SA
NC
VSS 0.1µF
0.1µF
NETWORK ANALYZER
AUDIO PRECISION
50Ω VDD
SB VS
RL 50Ω
GND
VS V p-p
IN
VOUT
D VIN
VOUT WITH SWITCH VOUT WITHOUT SWITCH
RL 110Ω
08319-016
GND
INSERTION LOSS = 20 log
RS
S
D VIN
VSS
Figure 36. THD + Noise
Figure 34. Bandwidth
Rev. B | Page 15 of 19
VOUT 08319-018
0.1µF
IN
0.1µF
0.1µF
0.1µF
IN
VSS
0.1µF
VSS
ADG1633/ADG1634
Data Sheet
TERMINOLOGY tBBM Off time measured between the 80% point of both switches when switching from one address state to another.
RON Ohmic resistance between Terminal D and Terminal S. ∆RON The difference between the RON of any two channels. RFLAT(ON) The difference between the maximum and minimum value of on resistance measured.
VIL Maximum input voltage for Logic 0. VIH Minimum input voltage for Logic 1.
IS (Off) Source leakage current when the switch is off.
IIL (IIH) Input current of the digital input.
ID (Off) Drain leakage current when the switch is off.
IDD Positive supply current.
ID, IS (On) Channel leakage current when the switch is on.
ISS Negative supply current.
VD (VS) Analog voltage on Terminal D and Terminal S.
Off Isolation A measure of unwanted signal coupling through an off channel.
CS (Off) Channel input capacitance for off condition.
Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching.
CD (Off) Channel output capacitance for off condition.
Bandwidth The frequency at which the output is attenuated by 3 dB.
CD, CS (On) On switch capacitance.
On Response The frequency response of the on switch.
CIN Digital input capacitance.
Total Harmonic Distortion + Noise (THD + N) The ratio of the harmonic amplitude plus noise of the signal to the fundamental.
tON (EN) Delay time between the 50% and 90% points of the digital input and switch on condition. tOFF (EN) Delay time between the 50% and 90% points of the digital input and switch off condition. tTRANS Delay time between the 50% and 90% points of the digital inputs and the switch on condition when switching from one address state to another.
AC Power Supply Rejection Ratio (ACPSRR) A measure of the ability of a part to avoid coupling noise and spurious signals that appear on the supply voltage pin to the output of the switch. The dc voltage on the device is modulated by a sine wave of 0.62 V p-p. The ratio of the amplitude of signal on the output to the amplitude of the modulation is the ACPSRR.
Rev. B | Page 16 of 19
Data Sheet
ADG1633/ADG1634
OUTLINE DIMENSIONS 5.10 5.00 4.90
16
9
4.50 4.40 4.30
6.40 BSC 1
8
PIN 1 1.20 MAX
0.15 0.05
0.20 0.09 0.30 0.19
0.65 BSC
COPLANARITY 0.10
0.75 0.60 0.45
8° 0°
SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 37. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) Dimensions shown in millimeters
0.30 0.23 0.18 0.50 BSC
13
PIN 1 INDICATOR
16 1
12 EXPOSED PAD
1.75 1.60 SQ 1.45
9
TOP VIEW 0.80 0.75 0.70 SEATING PLANE
0.50 0.40 0.30
4 8
5
0.25 MIN
BOTTOM VIEW
0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 38. 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm and 0.75 mm Package Height (CP-16-22) Dimensions shown in millimeters
Rev. B | Page 17 of 19
08-16-2010-E
PIN 1 INDICATOR
3.10 3.00 SQ 2.90
ADG1633/ADG1634
Data Sheet 6.60 6.50 6.40
20
11
4.50 4.40 4.30 6.40 BSC 1
10
PIN 1 0.65 BSC 1.20 MAX
0.15 0.05 COPLANARITY 0.10
0.30 0.19
0.20 0.09
0.75 0.60 0.45
8° 0°
SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 39. 20-Lead Thin Shrink Small Outline Package [TSSOP] (RU-20) Dimensions shown in millimeters
PIN 1 INDICATOR
4.10 4.00 SQ 3.90
0.30 0.25 0.20 0.50 BSC
20
16 15
PIN 1 INDICATOR
1
EXPOSED PAD
2.65 2.50 SQ 2.35 5
11
0.80 0.75 0.70 SEATING PLANE
0.50 0.40 0.30
6
0.25 MIN
BOTTOM VIEW
0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
Figure 40. 20-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.75 mm Package Height (CP-20-10) Dimensions shown in millimeters
Rev. B | Page 18 of 19
061609-B
TOP VIEW
10
Data Sheet
ADG1633/ADG1634
ORDERING GUIDE Model 1 ADG1633BRUZ ADG1633BRUZ-REEL7 ADG1633BCPZ-REEL7 ADG1634BRUZ ADG1634BRUZ-REEL7 ADG1634BCPZ-REEL7 1
Temperature Range −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C −40°C to +125°C
Description 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Thin Shrink Small Outline Package [TSSOP] 16-Lead Lead Frame Chip Scale Package [LFCSP] 20-Lead Thin Shrink Small Outline Package [TSSOP] 20-Lead Thin Shrink Small Outline Package [TSSOP] 20-Lead Lead Frame Chip Scale Package [LFCSP]
Z = RoHS Compliant Part.
©2009–2016 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08319-0-8/16(B)
Rev. B | Page 19 of 19
EN Pin Yes Yes Yes No No Yes
Package Option RU-16 RU-16 CP-16-22 RU-20 RU-20 CP-20-10
Branding
SD3