Triacs BT136 series - MICROPIK

Philips Semiconductors Product specification Triacs BT136 series Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), wher...

2 downloads 438 Views 53KB Size
Philips Semiconductors

Product specification

Triacs

BT136 series

GENERAL DESCRIPTION Glass passivated triacs in a plastic envelope, intended for use in applications requiring high bidirectional transient and blocking voltage capability and high thermal cycling performance. Typical applications include motor control, industrial and domestic lighting, heating and static switching.

PINNING - TO220AB PIN

DESCRIPTION

1

main terminal 1

2

main terminal 2

3

gate

QUICK REFERENCE DATA SYMBOL

PARAMETER

MAX. MAX. MAX. UNIT

VDRM

BT136BT136BT136Repetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current

500 500F 500G 500

600 600F 600G 600

800 800F 800G 800

V

4 25

4 25

4 25

A A

IT(RMS) ITSM

PIN CONFIGURATION

SYMBOL

tab

T2

tab

T1

G

1 23

main terminal 2

LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL

PARAMETER

VDRM

Repetitive peak off-state voltages

IT(RMS) ITSM

RMS on-state current Non-repetitive peak on-state current

I2t dIT/dt

IGM VGM PGM PG(AV) Tstg Tj

I2t for fusing Repetitive rate of rise of on-state current after triggering

Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature

CONDITIONS

MIN. -

full sine wave; Tmb ≤ 107 ˚C full sine wave; Tj = 25 ˚C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/µs T2+ G+ T2+ GT2- GT2- G+

over any 20 ms period

MAX. -500 5001

-600 6001

UNIT -800 800

V

-

4

A

-

25 27 3.1

A A A2s

-40 -

50 50 50 10 2 5 5 0.5 150 125

A/µs A/µs A/µs A/µs A V W W ˚C ˚C

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 3 A/µs. August 1997

1

Rev 1.200

Philips Semiconductors

Product specification

Triacs

BT136 series

THERMAL RESISTANCES SYMBOL

PARAMETER

Rth j-mb

Thermal resistance full cycle junction to mounting base half cycle Thermal resistance in free air junction to ambient

Rth j-a

CONDITIONS

MIN.

TYP.

MAX.

UNIT

-

60

3.0 3.7 -

K/W K/W K/W

STATIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL

PARAMETER

IGT

Gate trigger current

IL

Latching current

IH

Holding current

VT VGT

On-state voltage Gate trigger voltage

ID

Off-state leakage current

CONDITIONS

MIN.

BT136VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ VD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GT2- G+ VD = 12 V; IGT = 0.1 A IT = 5 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 ˚C VD = VDRM(max); Tj = 125 ˚C

TYP.

MAX.

UNIT

...

...F

...G

-

5 8 11 30

35 35 35 70

25 25 25 70

50 50 50 100

mA mA mA mA

-

7 16 5 7 5

20 30 20 30 15

20 30 20 30 15

30 45 30 45 30

mA mA mA mA mA

0.25

1.4 0.7 0.4

1.70 1.5 -

V V V

-

0.1

0.5

mA

MIN.

TYP.

MAX.

UNIT

DYNAMIC CHARACTERISTICS Tj = 25 ˚C unless otherwise stated SYMBOL

PARAMETER

dVD/dt

Critical rate of rise of off-state voltage

dVcom/dt

Critical rate of change of commutating voltage

tgt

Gate controlled turn-on time

August 1997

CONDITIONS BT136VDM = 67% VDRM(max); Tj = 125 ˚C; exponential waveform; gate open circuit VDM = 400 V; Tj = 95 ˚C; IT(RMS) = 4 A; dIcom/dt = 1.8 A/ms; gate open circuit ITM = 6 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/µs

2

... 100

...F 50

...G 200

250

-

V/µs

-

-

10

50

-

V/µs

-

-

-

2

-

µs

Rev 1.200

Philips Semiconductors

Product specification

Triacs

8

BT136 series

BT136

Ptot / W

Tmb(max) / C

5

101

IT(RMS) / A

BT136

104

7 6

= 180

1

107 C

4 107

120 5

110

90 60

4

3

113

30 3

116

2

119

1

122

2

1

0

0

1

2

3 IT(RMS) / A

125 5

4

0 -50

Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where α = conduction angle.

1000

50 Tmb / C

100

150

Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb.

BT136

ITSM / A

0

12

BT136

IT(RMS) / A

ITSM

IT

10 T

time

8

Tj initial = 25 C max 100

6 dIT /dt limit

4 T2- G+ quadrant

2 10 10us

100us

1ms T/s

10ms

0 0.01

100ms

Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp ≤ 20ms.

30

ITSM / A

BT136

T

Tj initial = 25 C max

1.2 1

10

0.8

5

0.6

1

10 100 Number of cycles at 50Hz

0.4 -50

1000

Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.

August 1997

BT136

1.4

time

15

0

VGT(Tj) VGT(25 C)

I TSM

IT

20

10

Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb ≤ 107˚C.

1.6

25

0.1 1 surge duration / s

0

50 Tj / C

100

150

Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.

3

Rev 1.200

Philips Semiconductors

Product specification

Triacs

3

BT136 series

IGT(Tj) IGT(25 C)

Tj = 125 C Tj = 25 C

T2+ G+ T2+ GT2- GT2- G+

2.5 2

8

1

4

0.5

2

50 Tj / C

100

0

150

Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.

3

IL(Tj) IL(25 C)

max

Vo = 1.27 V Rs = 0.091 ohms

6

0

typ

10

1.5

0 -50

BT136

IT / A

12

BT136

0

0.5

1

1.5 VT / V

2

2.5

3

Fig.10. Typical and maximum on-state characteristic.

10

TRIAC

BT136

Zth j-mb (K/W)

unidirectional

2.5

bidirectional 1

2 1.5 0.1

1

P D

tp

0.5

t

0 -50

0

50 Tj / C

100

0.01 10us

150

IH(Tj) IH(25C)

1ms

10ms

0.1s

1s

10s

tp / s

Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp.

Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), versus junction temperature Tj.

3

0.1ms

1000

TRIAC

dVcom/dt (V/us) off-state dV/dt limit BT136...G SERIES

2.5

BT136 SERIES

100

2

BT136...F SERIES

1.5 10

1 0.5 0 -50

dIcom/dt = 5.1 A/ms

0

50 Tj / C

100

1

150

3

50

2.3

1.8 100

1.4 150

Tj / C

Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dIT/dt. The triac should commutate when the dV/dt is below the value on the appropriate curve for pre-commutation dIT/dt.

Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), versus junction temperature Tj.

August 1997

0

3.9

4

Rev 1.200

Philips Semiconductors

Product specification

Triacs

BT136 series

MECHANICAL DATA Dimensions in mm

4,5 max

Net Mass: 2 g

10,3 max 1,3

3,7 2,8

5,9 min

15,8 max

3,0 max not tinned

3,0

13,5 min 1,3 max 1 2 3 (2x)

0,9 max (3x)

2,54 2,54

0,6 2,4

Fig.13. TO220AB; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8".

August 1997

5

Rev 1.200

Philips Semiconductors

Product specification

Triacs

BT136 series

DEFINITIONS Data sheet status Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification

This data sheet contains final product specifications.

Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification.  Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

August 1997

6

Rev 1.200

This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.